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  90136-2202 Datasheet PDF File

For 90136-2202 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

    0901362205 90136-2205

Molex Electronics Ltd.
Part No. 0901362205 90136-2205
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 5 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX Connector

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Amphenol Communications Solutions

Part No. 78290-136HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0901361107 90136-1107

Molex Electronics Ltd.
Part No. 0901361107 90136-1107
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 7 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 7 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 68690-136HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    0901361106 90136-1106

Molex Electronics Ltd.
Part No. 0901361106 90136-1106
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 6 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 6 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 69190-136HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0901361105 90136-1105

Molex Electronics Ltd.
Part No. 0901361105 90136-1105
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 5 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 5 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.33K  /  4 Page

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Amphenol Communications Solutions

Part No. 84512-202LF
Description 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free
Tech specs    

Official Product Page

    0901361104 90136-1104

Molex Electronics Ltd.
Part No. 0901361104 90136-1104
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 4 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 4 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 71922-020LF
Description Quickie®, Wire to Board connectors, Double Row, 20Positions, 2.54 mm (0.1 in.), Right Angle, Eject Latch Header.
Tech specs    

Official Product Page

    0901361103 90136-1103

Molex Electronics Ltd.
Part No. 0901361103 90136-1103
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 3 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 3 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 10082202-101-60LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Pin In Paste, Double row , 60 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0901361302 90136-1302

Molex Electronics Ltd.
Part No. 0901361302 90136-1302
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 2 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 159.50K  /  4 Page

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Amphenol Communications Solutions

Part No. 61082-202509PLF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 200 Positions.
Tech specs    

Official Product Page

    90136-1209 0901361209

Molex Electronics Ltd.
Part No. 90136-1209 0901361209
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 9 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 9 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 61082-202402LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 200 Positions.
Tech specs    

Official Product Page

    90136-1203 0901361203

Molex Electronics Ltd.
Part No. 90136-1203 0901361203
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 3 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 71922-020
Description Quickie®, Wire to Board connectors, Double Row, 20 Positions, 2.54 mm (0.1 in.), Right Angle, Eject Latch Header 0.76 um (30 u\\.) Gold or GXT™ Plating
Tech specs    

Official Product Page

    0901361402-17

Molex Electronics Ltd.
Part No. 0901361402-17
Description C-Grid III Header, Single Row, Vertical, Shrouded, 2 Circuits, Flash 0.10μm Gold (Au) Selective Plating

File Size 20.57K  /  2 Page

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Amphenol Communications Solutions

Part No. G874D122202C1EU
Description Mini power, Right Angle, Dual row, 4.2mm pitch, 12 positions , 100u\\ Tin, 2.30mm tail length, LCP, Natural , TRAY
Tech specs    

Official Product Page

For 90136-2202 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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