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  43650-0819 Datasheet PDF File

For 43650-0819 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

    0436501120 43650-1120

Molex Electronics Ltd.
Part No. 0436501120 43650-1120
Description 3.00mm (.118") Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with Press-fit Metal Retention
3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with Press-fit Metal Retention

File Size 169.25K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-112081950RLF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0436501118

Molex Electronics Ltd.
Part No. 0436501118
Description
File Size 169.20K  /  3 Page

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Amphenol Communications Solutions

Part No. 54242-812081900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0436501117

Molex Electronics Ltd.
Part No. 0436501117
Description 3.00mm (.118) Pitch Micro-Fit 3.0?/a> Header, Surface Mount Compatible, Single RowVertical, with PCB Polarizing Peg, 11 Circuits, 0.76μm (30μ) Gold (Au) Selective
3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single RowVertical, with PCB Polarizing Peg, 11 Circuits, 0.76μm (30μ) Gold (Au) Selective

File Size 153.64K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-809081900LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Row, 8 Positions
Tech specs    

Official Product Page

    0436500720 43650-0720

Molex Electronics Ltd.
Part No. 0436500720 43650-0720
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with Press-fit Metal Retention Clip, 7 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118) Pitch Micro-Fit 3.0?/a> Header, Surface Mount Compatible, Single Row, Vertical, with Press-fit Metal Retention Clip, 7 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 169.25K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-112081950LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0436500721

Molex Electronics Ltd.
Part No. 0436500721
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row,Vertical, with Press-fit Metal Retention Clip, 7 Circuits, Tin (Sn) Plating, Glow Wire Compatible

File Size 163.90K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-811081900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0436501116

Molex Electronics Ltd.
Part No. 0436501116
Description
File Size 153.64K  /  3 Page

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Amphenol Communications Solutions

Part No. 57102-F08-19LF
Description Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 38 Positions - 2mm (0.079inch) - Vertical
Tech specs    

Official Product Page

    0436501115

Molex Electronics Ltd.
Part No. 0436501115
Description
File Size 153.60K  /  3 Page

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Amphenol Communications Solutions

Part No. 57102-S08-19LF
Description Minitek® 2.00mm, Board/Wire to Board Connector, 2.00mm (0,079in), Unshrouded Vertical Header, Through Hole, Double Row, 38 Positions
Tech specs    

Official Product Page

    0436500426

Molex Electronics Ltd.
Part No. 0436500426
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with Solder Tab
MOLEX Connector

File Size 171.18K  /  3 Page

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Amphenol Communications Solutions

Part No. 54202-T0819LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 38 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0436501119

Molex Electronics Ltd.
Part No. 0436501119
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row,Vertical, with Press-fit Metal Retention Clip, 11 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 169.44K  /  3 Page

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Amphenol Communications Solutions

Part No. 57102-G08-19LF
Description Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 38 Positions - 2mm (0.079inch) - Vertical
Tech specs    

Official Product Page

    0436500526

Molex Electronics Ltd.
Part No. 0436500526
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with Solder Tab

File Size 170.65K  /  3 Page

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Amphenol Communications Solutions

Part No. 54121-112081950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 43650-0819 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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