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  42475-1811 Datasheet PDF File

For 42475-1811 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

    MAX518110 MAX5184BEEG

Maxim Integrated Products
Maxim Integrated Produc...
Part No. MAX518110 MAX5184BEEG
Description 10-Bit, 40MHz, Current/Voltage-Output DACs

File Size 216.64K  /  16 Page

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Amphenol Communications Solutions

Part No. 131-8118-11D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    2-1318115-9 2-1318114-6 2-1318115-3 2-1318120-3 2-1318114-4 2-1318116-3 2-1318118-6 2-1318119-3 2-1318115-4 2-1318118-9

Tyco Electronics
Part No. 2-1318115-9 2-1318114-6 2-1318115-3 2-1318120-3 2-1318114-4 2-1318116-3 2-1318118-6 2-1318119-3 2-1318115-4 2-1318118-9 2-1318115-6 2-1318114-3 2-1318118-8 2-1318114-9 2-1318117-3 1-1318118-6 3-1318118-6 1-1318118-8 1-1318118-9 1318108-1 1-1318120-3 1-1318119-3 1318112-1
Description AMP Dynamic Series Connectors
D-2000 Series (Wire-to-Board, Wire-to-Panel and Wire-to-Wire)
   D-2000 Series (Wire-to-Board, Wire-to-Panel and Wire-to-Wire)

File Size 3,331.74K  /  18 Page

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Amphenol Communications Solutions

Part No. 131-8118-11H
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    IMP1233M IMP1817 IMP1233D IMP1810 IMP1811 IMP1812 IMP1815 IMP1816

IMP Inc
IMP[IMP Inc]
IMP[IMP, Inc]
Part No. IMP1233M IMP1817 IMP1233D IMP1810 IMP1811 IMP1812 IMP1815 IMP1816
Description Low Power 5V/3.0V P Reset

File Size 108.07K  /  6 Page

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Amphenol Communications Solutions

Part No. 10131318-18111G0LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 18 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    0010181122 A30991203 10-18-1122 A-3099-1203

Molex Electronics Ltd.
Part No. 0010181122 A30991203 10-18-1122 A-3099-1203
Description 2.36mm (.093) Diameter Standard .093 Pin and Socket Header, 3 Rows, Shrouded, Unfilled Polyester, UL 94V-0, 12 Circuits, 12 Female Terminals
2.36mm (.093") Diameter Standard .093" Pin and Socket Header, 3 Rows, Shrouded, Unfilled Polyester, UL 94V-0, 12 Circuits, 12 Female Terminals
MOLEX Connector

File Size 106.10K  /  3 Page

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Amphenol Communications Solutions

Part No. 68418-112HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 12 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 10.16 mm (0.4 in.) Tail
Tech specs    

Official Product Page

    Samsung Electronic
Part No. K7P801811M K7P803611M
Description 256Kx36 & 512Kx18 Synchronous Pipelined SRAM Data Sheet

File Size 312.70K  /  13 Page

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Amphenol Communications Solutions

Part No. 77315-118-11LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions 2.54 mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    AUIRS21811S AUIRS21811STR AUIRS21811S-15

International Rectifier
Part No. AUIRS21811S AUIRS21811STR AUIRS21811S-15
Description HIGH AND LOW SIDE DRIVER

File Size 534.30K  /  20 Page

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Amphenol Communications Solutions

Part No. 77315-418-11LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

   
Part No. K7P403611A-H30 K7P401811A-H30
Description 128K X 36 STANDARD SRAM, 1.8 ns, PBGA119 14 X 22 MM, BGA-119

File Size 296.05K  /  13 Page

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Amphenol Communications Solutions

Part No. 131-4218-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K7P801811M-H20 K7P801811M-H21 K7P801811M-H25 K7P803611M-H20 K7P803611M-H21 K7P803611M-H25
Description 256Kx36 & 512Kx18 SRAM
256Kx36 & 512Kx18 SRAM

File Size 213.93K  /  13 Page

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Amphenol Communications Solutions

Part No. 131-5618-11D
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    K7P803611M-H21 K7P801811M K7P801811M-H20 K7P801811M-H21 K7P801811M-H25 K7P803611M K7P803611M-H20 K7P803611M-H25

SAMSUNG[Samsung semiconductor]
Part No. K7P803611M-H21 K7P801811M K7P801811M-H20 K7P801811M-H21 K7P801811M-H25 K7P803611M K7P803611M-H20 K7P803611M-H25
Description 256Kx36 & 512Kx18 SRAM

File Size 212.19K  /  13 Page

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Amphenol Communications Solutions

Part No. 131-7418-11D
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    MICRF218 MICRF218AYQS MICRF21811

Micrel Semiconductor
Part No. MICRF218 MICRF218AYQS MICRF21811
Description 3.3V, 315/433MHz Wide-IF Bandwidth ASK Receiver

File Size 834.54K  /  23 Page

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Amphenol Communications Solutions

Part No. 131-3218-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

For 42475-1811 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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