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For unsawn Found Datasheets File :: 292 Search Time::0.922ms
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				Zentrum Mikroelektronik Dresden AG
Part No.	ZMD31010 ZMD31010CEB ZMD31010CEC ZMD31010CED ZMD31010CEG1 ZMD31010KIT ZMD3101009
OCR Text	...Cable, 5 IC Samples Package unsawn on Wafer Sawn on Wafer Frame Waffle Pack Tube: add "-T" to sales code Reel: add "-R" Kit Sales and Further Information Zentrum Mikroelektronik Dresden AG (ZMD AG) Grenzstrasse 28 01109 Dresden Ger...
Description	RBicLite Low-Cost Sensor Signal Conditioner
File Size	5,651.71K / 2 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	SC0365.SERIES 2598
OCR Text	...n.a. n.a. 13000 Inked Probed unsawn Wafer (Wafer in Box) Probed Die in Tape & Reel Probed Die in Waffle Pack Inked Probed Sawn Wafer on Film 2 www.irf.com SC036.....5. Series Bulletin I0501J rev. D 05/01 Ordering Information...
Description	SCHOTTKY DIE 036 x 036 mils From old datasheet system
File Size	139.72K / 5 Page	View it Online	Download Datasheet

				Philips
Part No.	OM4068 OM4068_1 OM4068H/2 OM4068H/F2
OCR Text	...ine package; 40 leads (600 mil) unsawn wafer chip in tray APPLICATIONS * Telecom equipment * Portable instruments * Alarm systems * Automotive equipment. GENERAL DESCRIPTION OM4068 The OM4068 is a low-power CMOS LCD driver, designed t...
Description	OM4068; LCD driver for low multiplex rates From old datasheet system
File Size	117.05K / 28 Page	View it Online	Download Datasheet

				Zentrum Mikroelektronik Dresden AG
Part No.	ZMD310141
OCR Text	...Cable, 5 IC Samples Package unsawn on Wafer Sawn on Wafer Frame Waffle Pack Tube: add "-T" to sales code Reel: add "-R" Kit Sales and Further Information Zentrum Mikroelektronik Dresden AG (ZMD AG) Grenzstrasse 28 01109 Dresden Ger...
Description	RBic Low-Cost Sensor Signal Conditioner with I2C & SPI
File Size	1,204.27K / 2 Page	View it Online	Download Datasheet

				Infineon Technologies AG
Part No.	SIGC12T60SNC
OCR Text	...3.5 mm2 Package sawn on foil unsawn Ordering Code Q67041-A4664A001 Q67041-A4664A002 MECHANICAL PARAMETER: Raster size Area total / active Emitter pad size Gate pad size Thickness Wafer size Flat position Max.possible chips per wafe...
Description	IGBT Chip in NPT-technology 600V NPT technology positive temperature coefficient
File Size	75.05K / 4 Page	View it Online	Download Datasheet

				ATMEL Corporation
Part No.	T252506
OCR Text	...dering Information Delivering: unsawn wafers (DDW) in box. Extended Type Number T2525N0xx -DDW T2525N1xx -DDW T2525N2xx(1)-DDW T2525N3xx(1)-DDW T2525N6xx(1)-DDW T2525N7xx -DDW Notes: (1) (1) (1) PL(2) 2 1 2 1 2 1 RPU(3) 30 30 40 40 ...
Description	IR Receiver ASSP
File Size	137.34K / 12 Page	View it Online	Download Datasheet

				ATMEL Corporation
Part No.	T252509 T2525S0XXC-DDW T2525S1XXC-DDW T2525S2XXC-DDW T2525S3XXC-DDW T2525S6XXC-DDW T2525S7XXC-DDW
OCR Text	...dering Information Delivering: unsawn wafers (DDW) in box. Extended Type Number T2525S0xx C-DDW T2525S1xx C-DDW T2525S2xx(1)C-DDW T2525S3xx(1)C-DDW T2525S6xx(1)C-DDW T2525S7xx C-DDW Notes: (1) (1) (1) PL(2) 2 1 2 1 2 1 RPU(3) 30 30 ...
Description	IR Receiver ASSP
File Size	162.54K / 12 Page	View it Online	Download Datasheet

				Infineon Technologies AG
Part No.	SIGC14T60SNC
OCR Text	...3.8 mm2 Package sawn on foil unsawn Ordering Code Q67041-A4665A001 Q67041-A4665A002 MECHANICAL PARAMETER: Raster size Area total / active Emitter pad size Gate pad size Thickness Wafer size Flat position Max.possible chips per wafe...
Description	IGBT Chip in NPT-technology 600V NPT technology 100渭m chip short circuit prove
File Size	74.49K / 4 Page	View it Online	Download Datasheet

				Zentrum Mikroelektronik Dresden AG
Part No.	ZMD31030KIT ZMD31030AAF-R ZMD31030AAF-T
OCR Text	...rts ZMD31030AAB* dice on tested unsawn wafer ZMD31030AAC* dice on tested sawn wafer ZMD31030AAD* dice in waffle tray finished parts in tube ZMD31030AAF-R* finished parts in tape on reel ZMD31030KIT evaluation kit -40C to +125C -40C to +125C...
Description	Automotive Sensor Signal Conditioner with LIN Interface
File Size	518.32K / 2 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	SC070
OCR Text	...0 n.a 2500 2500 Inked Probed unsawn Wafer (Wafer in Box) Probed Die in Tape & Reel Probed Die in Waffle Pack Inked Probed Sawn Wafer on Film ww.DataSheet4U.com SC070xxxxx5P SC070xxxxx5F 2 www.irf.com www.DataSheet4U.com w...
Description	Schottky Die 70 x 92 Mils
File Size	322.32K / 5 Page	View it Online	Download Datasheet

For unsawn Found Datasheets File :: 292 Search Time::0.922ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |