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  TEM3-1211 Datasheet PDF File

For TEM3-1211 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    MLX12115

Melexis Microelectronic Systems
Part No. MLX12115
Description 13.56MHz RFID Transceiver

File Size 33.87K  /  1 Page

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Amphenol Communications Solutions

Part No. 10136353-12111LF
Description Minitek® 1.5mm Wire to Board Receptacle Right Angle Surface Mount Type, Tin plating, 12 positions
Tech specs    

Official Product Page

HUA FENG CIRCUIT





   
Part No. 12110754
Description
File Size 88.80K  /  1 Page

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Amphenol Communications Solutions

Part No. 54112-110102000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Microchip
Part No. MD1211LG-G
Description Ultrasound MOSFET Drivers

File Size 196.67K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-110062000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SRC1211K

AUK Corp
Part No. SRC1211K
Description Digital TR > Simple Type

File Size 49.60K  /  2 Page

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Amphenol Communications Solutions

Part No. 54112-112400900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SRC1211M

KODENSHI KOREA CORP.
Part No. SRC1211M
Description NPN Silicon Transistor

File Size 147.49K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-110402100LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SRC1211S

KODENSHI KOREA CORP.
Part No. SRC1211S
Description NPN Silicon Transistor

File Size 235.10K  /  4 Page

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Amphenol Communications Solutions

Part No. 20021211-00006T8LF
Description Minitek127®, Board/Wire to Board connector, Shrouded Vertical Header, Through Hole, Double Row, 6 Positions, 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

    SRC1211U

KODENSHI KOREA CORP.
Part No. SRC1211U
Description NPN Silicon Transistor

File Size 237.57K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-110101700LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    ZMD41211

Zentrum Mikroelektronik Dresden AG
Part No. ZMD41211
Description ISO 15693 Wireless Tag IC with Integrated Temperature Sensor

File Size 1,365.00K  /  47 Page

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Amphenol Communications Solutions

Part No. 10131319-12111G0LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 12 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    Semtech
Part No. SC1211VX
Description High Speed - Combi-Sense - Synchronous MOSFET Driver for Mobile Applications

File Size 321.33K  /  11 Page

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Amphenol Communications Solutions

Part No. 10137925-1211LF
Description Minitek® Pwr 3.0, Dual Row, Right Angle SMT Tails and DIP Hold Down Header, Tin plating, Black Color, 12 Positions, GW Compatible LCP, Tape and Reel. .
Tech specs    

Official Product Page

    CXA1211 CXA1211M

SONY[Sony Corporation]
Part No. CXA1211 CXA1211M
Description Electronic Volume, This bipolar IC incorporates 2 chnannels.

File Size 116.55K  /  10 Page

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Amphenol Communications Solutions

Part No. 20021211-00012T1LF
Description Minitek127®, Board/Wire to Board connector, Shrouded Vertical Header, Through Hole, Double Row, 12 Positions, 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

For TEM3-1211 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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