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MITSUBISHI[Mitsubishi Electric Semiconductor]
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Part No. |
RA30H1721M-101 RA30H1721M
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OCR Text |
... a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated wi...ceramic substrate in the module to crack by bending forces, either immediately when driving screws o... |
Description |
RoHS Compliance , 175-215MHz 30W 12.5V, 2 Stage Amp. For MOBILE RADIO
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File Size |
91.23K /
8 Page |
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it Online |
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MITSUBISHI[Mitsubishi Electric Semiconductor]
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Part No. |
RA30H2127M_06 RA30H2127M RA30H2127M-101 RA30H2127M06
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OCR Text |
... a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated wi...ceramic substrate in the module to crack by bending forces, either immediately when driving screws o... |
Description |
RoHS Compliance , 210-270MHz 30W 12.5V, 2 Stage Amp. For MOBILE RADIO
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File Size |
89.74K /
8 Page |
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it Online |
Download Datasheet |
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MITSUBISHI[Mitsubishi Electric Semiconductor]
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Part No. |
RA30H3340M_06 RA30H3340M RA30H3340M-101 RA30H3340M06
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OCR Text |
...on a plastic cap is attached by Silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate and coated by ...ceramic substrate in the module to crack by bending forces, either immediately when screwing or late... |
Description |
RoHS Compliance , 330-400MHz 30W 12.5V, 3 Stage Amp. For MOBILE RADIO
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File Size |
70.27K /
7 Page |
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it Online |
Download Datasheet |
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MITSUBISHI[Mitsubishi Electric Semiconductor]
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Part No. |
RA30H4047M_06 RA30H4047M RA30H4047M-101 RA30H4047M06
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OCR Text |
... a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated wi...ceramic substrate in the module to crack by bending forces, either immediately when driving screws o... |
Description |
RoHS Compliance , 400-470MHz 30W 12.5V, 3 Stage Amp. For MOBILE RADIO
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File Size |
105.00K /
8 Page |
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it Online |
Download Datasheet |
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Mitsubishi Electric Semicon... MITSUBISHI[Mitsubishi Electric Semiconductor]
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Part No. |
RA30H4452M_06 RA30H4452M RA30H4452M-101 RA30H4452M06
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OCR Text |
...on a plastic cap is attached by Silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate and coated by ...ceramic substrate in the module to crack by bending forces, either immediately when screwing or late... |
Description |
RoHS Compliance , 440-520MHz 30W 12.5V MOBILE RADIO
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File Size |
70.13K /
7 Page |
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it Online |
Download Datasheet |
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MITSUBISHI[Mitsubishi Electric Semiconductor]
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Part No. |
RA45H4047M_06 RA45H4047M RA45H4047M-101 RA45H4047M06
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OCR Text |
... a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated wi...ceramic substrate in the module to crack by bending forces, either immediately when driving screws o... |
Description |
RoHS Compliance, 400-470MHz 45W 12.5V, 3 Stage Amp. For MOBILE RADIO
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File Size |
103.42K /
8 Page |
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it Online |
Download Datasheet |
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MITSUBISHI[Mitsubishi Electric Semiconductor]
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Part No. |
RA45H4452M_06 RA45H4452M RA45H4452M-101 RA45H4452M06
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OCR Text |
... a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated wi...ceramic substrate in the module to crack by bending forces, either immediately when driving screws o... |
Description |
RoHS Compliance , 440-520MHz 45W 12.5V, 3 Stage Amp. For MOBILE RADIO
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File Size |
102.27K /
8 Page |
View
it Online |
Download Datasheet |
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MITSUBISHI[Mitsubishi Electric Semiconductor]
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Part No. |
RA60H1317M_06 RA60H1317M RA60H1317M-101 RA60H1317M06
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OCR Text |
... a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated wi...ceramic substrate in the module to crack by bending forces, either immediately when driving screws o... |
Description |
RoHS Compliance ,135-175MHz 60W 12.5V, 3 Stage Amp. For MOBILE RADIO
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File Size |
87.86K /
8 Page |
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it Online |
Download Datasheet |
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MITSUBISHI[Mitsubishi Electric Semiconductor]
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Part No. |
RA60H1317M1A
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OCR Text |
... a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated wi...ceramic substrate in the module to crack by bending forces, either immediately when driving screws o... |
Description |
RoHS Compliance ,136-174MHz 60W 12.5V, 2 Stage Amp. For MOBILE RADIO
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File Size |
118.69K /
9 Page |
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it Online |
Download Datasheet |
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ETC[ETC]
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Part No. |
RFP-250-100RM
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OCR Text |
... minimum amount of high quality silicone grease (.001" max. thickness). 4. Position device on mounting surface and secure using socket head screws, flat & split washers. Torque screws to the appropriate value. Make sure that the device is f... |
Description |
Flanged Resistors
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File Size |
516.79K /
2 Page |
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it Online |
Download Datasheet |
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Price and Availability
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