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For particles Found Datasheets File :: 951    Search Time::1.734ms    
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    BGY1816 BGY1816N

PHILIPS[Philips Semiconductors]
NXP Semiconductors
Part No. BGY1816 BGY1816N
OCR Text ...t and free from burrs and loose particles. The heatsink should be rigid and not prone to bowing under thermal cycling conditions. The thickness of a solid heatsink should be not less than 5 mm to ensure a rigid assembly. A thin, even layer ...
Description UHF amplifier module

File Size 84.52K  /  12 Page

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    MP04HBT-16 MP04HBN-16 MP04HBP-16 MP04HBP590-18 MP04HBN14 MP04HBN590-18 MP04HBT590-18 MP04HBT14 MP04---590-16 MP04---590-

DYNEX[Dynex Semiconductor]
Dynex Semiconductor Ltd.
Dynex Semiconductor, Ltd.
Part No. MP04HBT-16 MP04HBN-16 MP04HBP-16 MP04HBP590-18 MP04HBN14 MP04HBN590-18 MP04HBT590-18 MP04HBT14 MP04---590-16 MP04---590-18 MP04---590-14
OCR Text ...d be taken to ensure no foreign particles remain. An even coating of thermal compound (eg. Unial) should be applied to both the heatsink and module mounting surfaces. This should ideally be 0.05mm (0.002") per surface to ensure optimum the...
Description    Dual Thyristor, Thyristor/Diode Module
Dual Thyristor Thyristor/Diode Module
Enclosure NEMA Type:1, 4, 4X, 12, 13; Enclosure Material:Polycarbonate; External Height:3.5"; External Width:9.8"; External Depth:6.3"; Enclosure Color:Clear 935 A, 1800 V, SCR
Circular Connector; No. of Contacts:3; Series:; Body Material:Aluminum; Connecting Termination:Solder; Connector Shell Size:12; Circular Contact Gender:Pin; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:12-3 935 A, 1400 V, SCR
PT 3C 3#16 SKT RECP 935 A, 1800 V, SCR
Euronord Enclosure; NEMA Type:1, 4, 4X, 12, 13; Enclosure Material:Polycarbonate; External Height:9.8"; External Width:6.3"; External Depth:4.9"; Enclosure Color:Clear 935 A, 1600 V, SCR

File Size 228.25K  /  10 Page

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    RA07N4047M RA07N4047M-01 RA07N4047M-E01

Mitsubishi Electric, Corp.
MITSUBISHI[Mitsubishi Electric Semiconductor]
Mitsubishi Electric Corporation
Part No. RA07N4047M RA07N4047M-01 RA07N4047M-E01
OCR Text ...a heat sink that is not flat or particles between module and heat sink may cause the ceramic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A the...
Description MITSUBISHI RF MOSFET MODULE 三菱射频MOSFET模块
30V N-Channel PowerTrench MOSFET

File Size 61.24K  /  9 Page

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    RA35H1516M RA35H1516M-01 RA35H1516M-E01

Mitsubishi Electric Sem...
Mitsubishi Electric Corporation
MITSUBISHI[Mitsubishi Electric Semiconductor]
Mitsubishi Electric, Corp.
Part No. RA35H1516M RA35H1516M-01 RA35H1516M-E01
OCR Text ...a heat sink that is not flat or particles between module and heat sink may cause the ceramic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A the...
Description 154-162MHz 40W 12.5V MOBILE RADIO 154 - 162MHz功率40W 12.5V移动通信
154 MHz - 162 MHz RF/MICROWAVE NARROW BAND HIGH POWER AMPLIFIER

File Size 74.15K  /  8 Page

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    74AUC1G08 74AUC1G08GW 74AUC1G08GV

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. 74AUC1G08 74AUC1G08GW 74AUC1G08GV
OCR Text ...te (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for ...
Description 1.8V Single 2-Input AND Gate
From old datasheet system

File Size 50.57K  /  12 Page

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    74HCT1G08 74HC1G08 74HC_HCT1G08_3 74HC1G08GV 74HC1G08GW 74HCT1G08GV 74HCT1G08GW

PHILIPS[Philips Semiconductors]
NXP Semiconductors
Part No. 74HCT1G08 74HC1G08 74HC_HCT1G08_3 74HC1G08GV 74HC1G08GW 74HCT1G08GV 74HCT1G08GW
OCR Text ...te (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for ...
Description 74HC1G08; 74HCT1G08; 2-input AND gate
From old datasheet system

File Size 68.38K  /  16 Page

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    NXP Semiconductors N.V.
ANALOGICTECH[Advanced Analogic Technologies]
PHILIPS[Philips Semiconductors]
Part No. BGF802-20 BGF802-20_4
OCR Text ...t and free from burrs and loose particles. We recommend a flatness for the mounting area of between 50 m concave and 50 m convex. The 50 m concave value is to ensure optimal thermal behaviour, while the 50 m convex value is intended to limi...
Description CDMA800 power module
From old datasheet system

File Size 89.84K  /  12 Page

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    Intersil
Part No. HM-65262_883 FN3003
OCR Text ...t errors due to noise and alpha particles. This stability also improves the radiation tolerance of the RAM over that of four transistor (4T) devices. Features * This Circuit is Processed in Accordance to MIL-STD883 and is Fully Conforma...
Description 16K x 1 Asynchronous CMOS Static RAM
From old datasheet system

File Size 82.60K  /  9 Page

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    Matsshita / Panasonic
Part No. ON1120 CNZ1120
OCR Text ...enuation resulting from dust or particles A' (15.5) 2-0.45 (2.54) SEC. A-A' 2 3 2 3 1 4 1 Pin connection 4 Absolute Maximum Ratings (Ta = 25C) Parameter Input (Light Forward current (DC) emitting diode) Power dissipati...
Description Opto-Electronic Device - PhotocouplersPhotosensors - Transmissive Photosensors
Transmissive Photosensors (Photo Interrupters)

File Size 42.20K  /  2 Page

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    RA07M4452M RA07M4452M-01 RA07M4452M-E01

MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA07M4452M RA07M4452M-01 RA07M4452M-E01
OCR Text ...a heat sink that is not flat or particles between module and heat sink may cause the ceramic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A the...
Description 440-520MHz 7W 7.2V, 2 Stage Amp. For PORTABLE RADIO

File Size 61.05K  /  9 Page

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For particles Found Datasheets File :: 951    Search Time::1.734ms    
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