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  HM33-10050 Datasheet PDF File

For HM33-10050 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

   
Part No. APT10050CFN APT9050CFN
Description TRANSISTOR | MOSFET POWER MODULE | INDEPENDENT | 1KV V(BR)DSS | 24.5A I(D)
TRANSISTOR | MOSFET POWER MODULE | INDEPENDENT | 900V V(BR)DSS | 24.5A I(D)

File Size 108.28K  /  2 Page

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Amphenol Communications Solutions

Part No. G832MB011005022HR
Description 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 7.7 mm, 100ΩPositions, Dual Row, BTB Vertical Receptacle SMT, Gold Flash Black.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Bourns Inc.
Bourns, Inc.
Part No. CI100505-5N6D CI100505-R10J CI100505-8N2J CI100505-12NJ CI100505-15NJ CI100505-18NJ CI100505-22NJ CI100505-27NJ CI100505-33NJ CI100505-39NJ CI100505-47NJ CI100505-56NJ CI100505-1N0D CI100505-4N7D CI100505-1N5D CI100505-2N2D CI100505-68NJ CI100505-82NJ CI100505-2N7D
Description Multi-Layer Chip Inductors 1 ELEMENT, 0.0015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD

File Size 430.53K  /  2 Page

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Amphenol Communications Solutions

Part No. 54112-803100500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    R474R41005001K

Kemet Corporation
Part No. R474R41005001K
Description Capacitor, film, Metallized Polypropylene, 1 uF, /-10% Tol, -40/ 110C, Safety: X2, 440 VAC, Lead Spacing=27.5 mm

File Size 48.18K  /  1 Page

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Amphenol Communications Solutions

Part No. G832MB031005022HR
Description 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 7.7 mm, 100ΩPositions, Dual Row, BTB Vertical Receptacle SMT, Gold Flash White.
Tech specs    

Official Product Page

    R463F210050N0K

Kemet Corporation
Part No. R463F210050N0K
Description Capacitor, film, 0.01 uF, /-10% Tol, -40/ 110C, Safety: X2, 310 VAC, Lead Spacing=10 mm

File Size 49.04K  /  1 Page

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Amphenol Communications Solutions

Part No. 20021221-10050T9LF
Description Minitek127® 1.27mm Wire/Cable-to-Board Connector System, Shrouded vertical header, Surface Mount, Double Row, 50 Positions, 1.27mm (0.500in) Pitch.
Tech specs    

Official Product Page

    R463F310050M1M

Kemet Corporation
Part No. R463F310050M1M
Description Capacitor, film, 0.1 uF, /-20% Tol, -40/ 110C, Safety: X2, 310 VAC, Lead Spacing=10 mm

File Size 48.33K  /  1 Page

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Amphenol Communications Solutions

Part No. 68015-410-050142LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 10 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    R474I31005001K

Kemet Corporation
Part No. R474I31005001K
Description Capacitor, film, Metallized Polypropylene, 0.1 uF, /-10% Tol, -40/ 110C, Safety: X2, 440 VAC, Lead Spacing=15 mm

File Size 48.70K  /  1 Page

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Amphenol Communications Solutions

Part No. 20021221-10050C9LF
Description Minitek127® Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 50 Positions, 1.27mm (0.500in) Pitch.
Tech specs    

Official Product Page

    R463N410050N2M

Kemet Corporation
Part No. R463N410050N2M
Description Capacitor, film, 1 uF, /-20% Tol, -40/ 110C, Safety: X2, 310 VAC, Lead Spacing=22.5 mm

File Size 48.81K  /  1 Page

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Amphenol Communications Solutions

Part No. 20021321-10050D4LF
Description PCB mounted Receptacle, Vertical, Surface Mount, Double Row, 50 Positions, 1.27mm (0.05inch) pitch
Tech specs    

Official Product Page

    R474I310050A1K

Kemet Corporation
Part No. R474I310050A1K
Description Capacitor, film, Metallized Polypropylene, 0.1 uF, /-10% Tol, -40/ 110C, Safety: X1, 440 VAC, Lead Spacing=15 mm

File Size 48.71K  /  1 Page

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Amphenol Communications Solutions

Part No. 54112-802100500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Advanced Power Technolo...
ADPOW[Advanced Power Technology]
Part No. APT10050JVFR_04 APT10050JVFR APT10050JVFR04
Description Power MOS V is a new generation of high voltage N-Channel enhancement mode power MOSFETs.

File Size 64.42K  /  4 Page

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Amphenol Communications Solutions

Part No. 59112-T28-10-050LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 20 Positions.
Tech specs    

Official Product Page

    R60PF2100506AJ

Kemet Corporation
Part No. R60PF2100506AJ
Description    Film, Metallized Polyester Stacked, Commercial Grade, R60, 0.01 uF, 5%, 630 V, 85C, Lead Spacing = 10mm

File Size 47.82K  /  1 Page

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Amphenol Communications Solutions

Part No. CE1005000110111
Description Cool Edge 0.80mm Hybrid Power and Signal Connectors, Storage and Server System, Surface mount, 50 signal pins, Vertical
Tech specs    

Official Product Page

For HM33-10050 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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