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flip-die Datasheet PDF File

For flip-die Found Datasheets File :: 2580 Search Time::1.421ms
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				ONSEMI[ON Semiconductor]
Part No.	NCP2821 NCP2821D
OCR Text	...semi.com MARKING DIAGRAM 9-PIN FLIP-CHIP CSP FC SUFFIX CASE 499AL MAU A Y WW G MAUG AYWW 1 A1 = Device Code = Assembly Location = Yea...DIE TEMPERATURE (C) 80 EFFICIENCY (%) 70 60 50 40 30 20 10 0 0 0.5 Pout (W) 1.0 Vp = 5 V RL = 8 W Cl...
Description	2.65 W Filterless with Selectable Gain Class−D Audio Amplifier
File Size	244.02K / 19 Page	View it Online	Download Datasheet

				TriQuint Semiconductor
Part No.	TGS4305-FC
OCR Text	Flip Chip Key Features * * * * * * * Frequency Range: 60-90 GHz 2.3 dB Typical Flipped Insertion Loss 20 dB Nominal Isolation > 13 dB Typi...Die x,y size tolerance: +/- 0.050 (0.002) Chip edge to pillar dimensions are shown to center of pill...
Description	60-90 GHz SP3T Switch Flip Chip
File Size	282.13K / 11 Page	View it Online	Download Datasheet

				TriQuint Semiconductor, Inc.
Part No.	TGC4704-FC
OCR Text	...on the triquint tgc4704-fc is a flip-chip frequency doubler. it combines an output medium power amplifier and a frequency doubler at frequ...die reliability is enhanced by using triquint?s bcb polymeric passivation process. the tgc4704-fc ...
Description	38 to 77 GHz Doubler and Medium Power Amplifier 76000 MHz - 77000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
File Size	450.13K / 12 Page	View it Online	Download Datasheet

				STMicroelectronics
Part No.	AN1235
OCR Text	flip chip: package description and recommendations for use introduction this document provides package and usage recommendation informatio...die size and bump count are adapted to the connection requirements. figure 2. mechanical dimensions...
Description	package description and recommendations for use
File Size	233.19K / 14 Page	View it Online	Download Datasheet

				NJR Corporation
Part No.	NJU6312
OCR Text	flip ! general description ! pakage outline the nju6312 series is c-mos quartz crystal oscillator ic for fundamental (up to 80mhz) oscillation. the pad arrangement suitable for flip die mount simplifies development of small-sized...
Description	0.9V Operation Fundamental Quartz Crystal Oscillator IC
File Size	132.47K / 6 Page	View it Online	Download Datasheet

				STMicroelectronics
Part No.	EMIF03-SIM01 7784
OCR Text	...interferences. The EMIF03-SIM01 flip-chip packaging means the package size is equal to the die size. That's why EMIF03-SIM01 is a very small device. Additionally, this filter includes an ESD protection circuitry which prevents the protected...
Description	3 LINES EMI FILTER INCLUDING ESD PROTECTION From old datasheet system
File Size	151.58K / 11 Page	View it Online	Download Datasheet

				ALPHA[Alpha Industries]
Part No.	DMK8001-000
OCR Text	Flip Chip Schottky Diodes Features Single - DMK2783-000, DMK2790-000 I Designed for High Volume Designs I High Frequency (20-100 GHz) I...Die Bonder Materials Epoxy Microelectronic grade one component, solvent-free silver-filled, electri...
Description	GaAs Flip Chip Schottky Diodes
File Size	83.90K / 4 Page	View it Online	Download Datasheet

				BOURNS[Bourns Electronic Solutions]
Part No.	2DAA-F6RLF 2DAA-F6R
OCR Text	...mm and is available in a 6 bump Flip Chip package intended to be mounted directly onto an FR4 printed circuit board. The Flip Chip device me...DIE Electrical & Thermal Characteristics Electrical Characteristics (TA = 25 C unless otherwi...
Description	Integrated Passive & Active Device
File Size	222.37K / 4 Page	View it Online	Download Datasheet

				ST Microelectronics
Part No.	STPTIC-47F1M6 STPTIC-33G1H5 STPTIC-68G1H5 STPTIC-33F1M6 STPTIC-47G1H5 STPTIC-39G1H5 STPTIC-39F1M6
OCR Text	...fn package 1.2 x 1.6 x 0.9 mm ? flip chip 0.65 x 1.0 x 0.3 mm ? flip chip 0.65 x 1.2 x 0.3 mm ? ecopack ? 2 compliant component benefit ? rf...die size 650 x 1200) 170 m 225 m 260 m 250 x 230 m 250 x 500 m 200 x 180 m 200 x 750 m solder mask m...
Description	BST tunable integrated RF capacitor
File Size	182.22K / 13 Page	View it Online	Download Datasheet

For flip-die Found Datasheets File :: 2580 Search Time::1.421ms
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