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A2030 991505 V22MA1B SVC342 JST55 1209S AST21P1E INTERNA
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For embedding Found Datasheets File :: 691    Search Time::3.265ms    
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    MICROSEMI[Microsemi Corporation]
Part No. LX5503ELQ LX5503E
OCR Text ...al measured data without any de-embedding. Source EVM from is around 1.4~1.8% for the input power levels for test. Copyright (c) 2000 Rev. 1.2d, 2005-08-18 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA...
Description InGaP HBT 4 - 6GHz Power Amplifier

File Size 236.29K  /  9 Page

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    SLE66C42P SLE66C42PM5 SLE66C42PC

INFINEON[Infineon Technologies AG]
Part No. SLE66C42P SLE66C42PM5 SLE66C42PC
OCR Text ... as wire-bonded module (M5) for embedding in plastic cards or as die (C) for customer packaging Short Product Information 5/8 11.02 SLE 66C42P Pin Configuration VCC GND CLK SLE 66C42P RST I/O Figure 1: Pin C...
Description Security & Chip Card ICs

File Size 33.42K  /  7 Page

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    MICROSEMI[Microsemi Corporation]
Part No. LX5506
OCR Text ...al measured data without any de-embedding. Source EVM is around 1.4 - 1.8% for the input power levels for test. ACPR VS OUTPUT POWER -40 -41 -42 -43 -44 -45 -46 -47 -48 -49 -50 -51 -52 -53 -54 -55 15 Freq=5.15GHz Freq=5.85GHz 28 P1dB 27 ...
Description InGaP HBT 4.5 - 6GHz Power Amplifier

File Size 496.83K  /  10 Page

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    OKI electronic components
OKI[OKI electronic componets]
Part No. MG65P MG63P MG64P
OCR Text ...nologies and wide experience of embedding SDRAM in logic products, Oki is able to integrate SDRAM and ASIC technology. The merged DRAM/ASIC process efficiently implements the Oki stacked capacitor memory cell. The MG63P/64P/65P CSA series u...
Description 0.25m Embedded DRAM/ Customer Structured Arrays
0.25レm Embedded DRAM/ Customer Structured Arrays

File Size 125.78K  /  22 Page

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    http://
INFINEON[Infineon Technologies AG]
Part No. PMB9500
OCR Text ...-rate scalable Node B solutions embedding customer proprietary radio link, power control and measurement algorithms. Software Features Supports 3GPP release 99 and release 4 physical channel processing requ...
Description 3G Basestation Pro cessor

File Size 2,346.13K  /  2 Page

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    RENESAS[Renesas Electronics Corporation]
Part No. R8C27 R5F21262SDFP R5F21262SDXXXFP R5F21262SNFP R5F21262SNXXXFP R5F21264JFP R5F21264JXXXFP R5F21264KFP R5F21264KXXXFP R5F21264SDFP R5F21264SDXXXFP R5F21264SNFP R5F21264SNXXXFP R5F21265SDFP R5F21265SDXXXFP R5F21265SNFP R5F21265SNXXXFP R5F21266JFP R5F21266JXXXFP R5F21266KFP R5F21266KXXXFP R5F21266SDFP R5F21266SDXXXFP R5F21266SNFP R5F21266SNXXXFP R5F21272SDFP R5F21272SDXXXFP R5F21272SNFP R5F21272SNXXXFP R5F21274JFP R5F21274JXXXFP R5F21274KFP R5F21274KXXXFP R5F21274SDFP R5F21274SDXXXFP R5F21274SNFP R5F21274SNXXXFP R5F21275SDFP R5F21275SDXXXFP R5F21275SNFP R5F21275SNXXXFP R5F21276JFP R5F21276JXXXFP R5F21276KFP R5F21276KXXXFP R5F21276SDFP R5F21276SDXXXFP R5F21276SNFP R5F21276SNXXXFP R8C26
OCR Text ...ance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, th...
Description SINGLE-CHIP 16-BIT CMOS MCU

File Size 577.26K  /  73 Page

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    RENESAS[Renesas Electronics Corporation]
Part No. R8C29 R5F21282SDSP R5F21282SDXXXSP R5F21282SNSP R5F21282SNXXXSP R5F21284JSP R5F21284JXXXSP R5F21284KSP R5F21284KXXXSP R5F21284SDSP R5F21284SDXXXSP R5F21284SNSP R5F21284SNXXXSP R5F21292SDSP R5F21292SDXXXSP R5F21292SNSP R5F21292SNXXXSP R5F21294JSP R5F21294JXXXSP R5F21294KSP R5F21294KXXXSP R5F21294SDSP R5F21294SDXXXSP R5F21294SNSP R5F21294SNXXXSP R8C28
OCR Text ...ance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, t...
Description SINGLE-CHIP 16-BIT CMOS MCU

File Size 565.97K  /  71 Page

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    RFMD[RF Micro Devices]
Part No. RF6001_06 RF6001 RF600106
OCR Text ...sed pad and terminals. 5 Exlude embedding part of exposed pad from measuring. 0.50 0.30 TYP 0.50 5.25 SQ 4.95 Package Style: QFN, 48-Pin, 7x7 GaAs HBT SiGe HBT GaN HEMT MCK/ TXQB MS/ TXIB MDI/ TXQ SSB SDI GaAs MESFET Si CMOS...
Description FRACTIONAL-N RF SYNTHESIZER WITH MODULATOR AND DIGITAL IF FILTER Part of the POLARISTM TOTAL RADIOTM Solution

File Size 41.88K  /  2 Page

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    sirenza.com
SIRENZA[SIRENZA MICRODEVICES]
Part No. SLD-1000
OCR Text ...7 1.2 + j 5.7 1.7 + j 6.4 De-embedding Information Description Number of Bond Wires Length of Bond Wires Height of Bond Wires Pitch of Bond Wires Bond Wire Diameter Gate 2 0.040 0.006 0.005 0.002 Drain 3 0.040 0.006 0.005 0.002 Imped...
Description 4 Watt Discrete LDMOS FET-Bare Die

File Size 324.11K  /  5 Page

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