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die wafer Datasheet PDF File

For die wafer Found Datasheets File :: 4914 Search Time::1.938ms
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				Mini-Circuits
Part No.	KAT-0-D
OCR Text	...wave precision fixed attenuator die notes a. performance and quality attributes and conditions not expressly stated in this specifcation d...wafer vias to realize low thermal resistance and wideband operation. simplifed schematic orderin...
Description	Fixed Attenuator die
File Size	261.55K / 4 Page	View it Online	Download Datasheet

				Infineon Technologies AG
Part No.	IGC70T120T6RM
OCR Text	...T6RM VCE 1200V ICn 75A die Size 9.12 x 7.71 mm 2 Package sawn on foil MECHANICAL PARAMETER Raster size Emitter pad size (incl. gate pad) Gate pad size Area total / active Thickness wafer size Flat position Max.possible chips ...
Description	IGBT4 Medium Power Chip
File Size	70.08K / 5 Page	View it Online	Download Datasheet

				Infineon Technologies AG
Part No.	IGC70T120T6RL
OCR Text	...T6RL VCE 1200V ICn 75A die Size 9.12 x 7.71 mm 2 Package sawn on foil MECHANICAL PARAMETER Raster size Emitter pad size (incl. gate pad) Gate pad size Area total / active Thickness wafer size Flat position Max.possible chips ...
Description	IGBT4 Low Power Chip
File Size	70.48K / 5 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	SL3S12031213 SL3S1203FTB0 SL3S1203FUF SL3S1213FTB0 SL3S1213FUF
OCR Text	...r XSON6 Description bumped G2iL die on sawn 8" wafer bumped G2iL+ die on sawn 8" wafer Version not applicable not applicable Type number G2iL, plastic extremely thin small outline SOT886F1 package; no leads; 6 terminals; body 1 x 1.45 x ...
Description	UCODE G2iL and G2iL
File Size	148.43K / 22 Page	View it Online	Download Datasheet

				Vectron International, Inc
Part No.	DOC200103
OCR Text	...ass s devices. th e prescribed die carries a class 2 esds classification in accordance with mil-prf-38535. a lthough radiation testing is...wafer lot will be provided for all class s versions of this tcxo. this microcircuit is certified ...
Description	Specification, Hybrid TCXO
File Size	264.98K / 20 Page	View it Online	Download Datasheet

				Emerging Memory & Logic Solutions
Part No.	EM640FV16FW
OCR Text	...ical specifications - backside die surface of polished bare silicon - typical die thickness = 725um - typical top-level metalization : ...wafer diameter : 8 inch options - c1/w1 : dc probed die/wafer @ hot temp - c2/w2 : dc/ac probed die/...
Description	256K x16 bit Low Power and Low Voltage Full CMOS Static RAM
File Size	118.43K / 11 Page	View it Online	Download Datasheet

				NXP Semiconductors N.V.
Part No.	PCA2000UAC PCA2001U1 PCA2001UAC PCA2001CX81 PCA2001CX85 PCA2000U10AC PCA2000CX81 PCA2000CX812 PCA2000CX85 PCA2000U1 PCA200010 PCA2001U10AC
OCR Text	... PCA200xU Description wire bond die; 8 bonding pads; 1.16 x 0.86 x 0.22 mm wire bond die; 8 bonding pads; 1.16 x 0.86 x 0.22 mm wire bond di...wafer level chip-size package; 8 bumps wafer level chip-size package; 8 bumps wafer level chip-size ...
Description	32 kHz watch circuit with programmable adaptive motor pulse
File Size	217.89K / 30 Page	View it Online	Download Datasheet

				KEC
Part No.	K3520PQ-XH
OCR Text	... s2 s1 g1 bottom : common drain die information contents v alue wafer size 8 inch notch type wafer thickness 180um front metal a -4um back metal ti/ni/ag-1.4um passivation layer yes die size (with scribe lane) 2000 ?? 1080 - 2 scribe lane ...
Description	Common-Drain Dual N-Channel Enhancement Mode Field Effect Transistor
File Size	67.69K / 3 Page	View it Online	Download Datasheet

For die wafer Found Datasheets File :: 4914 Search Time::1.938ms
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