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bondpad Datasheet PDF File

For bondpad Found Datasheets File :: 141 Search Time::0.891ms
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				MA-Com MACOM[Tyco Electronics]
Part No.	MASW20000
OCR Text	...035 x 0.004 (2.10 x 0.89x 0.10) bondpad Dimensions Inches (mm) RF, RF1, RF2: 0.004 x 0.004 (0.100 x 0.100) 0.004 x 0.004 (0.100 x 0.100) A1, A2, B1, B2: Wire Bonding A. Ball or wedge bond with 1.0 mil diameter pure gold wire. Gold ri...
Description	DC-20 GHz GaAs SPDT switch GaAs SPDT Switch DC - 20 GHz
File Size	86.61K / 2 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	HTMS8201FTK HTMS8X01
OCR Text	... fig 2. hitag - mega bumps bondpad locations table 3. hitag - mega bumps dimensions description dimension (x) chip size 550 ? m (y) chip size 550 ? m (1) pad center to chip edge 100.5 ? m (2) pad center to chip edge 48.708 ? m (3)...
Description	HITAG transponder IC
File Size	464.09K / 57 Page	View it Online	Download Datasheet

				Microchip Technology, Inc. Amphenol, Corp. MicrochipTechnology Microchip Technology Inc. MICROCHIP[Microchip Technology]
Part No.	24C02SC 24C02SC-S 24C02SC-S08 24C02SC-W 24C02SC-W08 24C02SC-WF 24C02SC-WF08 24C01SC 24C01SC-S 24C01SC-S08 24C01SC-W 24C02 24C01SC-W08 24C01SC-WF 24C01SC-WF08 21C02SC 21C01SC
OCR Text	...lectrically Erasable PROMs with bondpad positions optimized for smart card applications. The devices are organized as a single block of 128 x 8-bit or 256 x 8-bit memory with a two-wire serial interface. The 24C01SC and 24C02SC also have pa...
Description	24C01C-P 24C01C-IP 24C01C-EP 24C01C-SN 24C01C-ISN 24C01C-ESN 24C01C-ST 24C01C-IST 24C01C-EST 24C01C24C01C的IP 24C01C -内啡24C01C24C01C，无法真正传24C01C - ESN24C01C ST24C01C -北京时间24C01C -学报 24C01C-P 24C01C-IP 24C01C-EP 24C01C-SN 24C01C-ISN 24C01C-ESN 24C01C-ST 24C01C-IST 24C01C-EST 24C01C4C01C的IP 24C01C -内啡4C01C4C01C，无法真正传4C01C - ESN4C01C ST4C01C -北京时间24C01C -学报 1K 5.0V IIC serial EEPROMs for smart card(1K5.0V,ISO7816标准,EEPROM) 2K 5.0V IIC serial EEPROMs for smart card(2K5.0V,ISO7816标准,EEPROM) 1K/2K 5.0V I2C Serial EEPROMs for Smart Cards 24C01C-P24C01C-IP24C01C-EP24C01C-SN24C01C-ISN24C01C-ESN24C01C-ST24C01C-IST24C01C-EST
File Size	78.52K / 12 Page	View it Online	Download Datasheet

				MAXIM - Dallas Semiconductor MAXIM[Maxim Integrated Products]
Part No.	MAX6713ZEXS
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 30 x 30 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Copper/Silicon None .8 microns (as drawn) .8 microns (as drawn) 5 mil...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	54.74K / 8 Page	View it Online	Download Datasheet

				Maxim Integrated Products
Part No.	MAX811TEUS
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 37 x 31 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Copper/Si None 1.2 microns (as drawn) 1.2 microns (as drawn) 5 mil. S...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	54.89K / 8 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	HTMS1001FTB HTMS1001FTK HTMS1001FUG HTMS1101FTB HTMS1101FTK HTMS1101FUG HTMS1201FTB HTMS1201FTK HTMS1201FUG HTMS8201FTK HTMS8101FTK HTMS8101FTB HTMS8101FUG
OCR Text	... fig 2. hitag - mega bumps bondpad locations table 3. hitag - mega bumps dimensions description dimension (x) chip size 550 m (y) chip size 550 m (1) pad center to chip edge 100.5 m (2) pad center to chip edge 48.708 m (3) pad center ...
Description	HITAG μ (ISO14223) and (ISO11784/85) Transponder IC
File Size	459.96K / 57 Page	View it Online	Download Datasheet

For bondpad Found Datasheets File :: 141 Search Time::0.891ms
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