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  90663-1162 Datasheet PDF File

For 90663-1162 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    90663-1342 0906631342

Molex Electronics Ltd.
Part No. 90663-1342 0906631342
Description 2.54mm (.100") Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 34 Circuits
2.54mm (.100) Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 34 Circuits

File Size 184.33K  /  4 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. 2SA1162
Description PNP Bipolar Transistor / VCEO=-50 V / IC=-0.15 A / hFE=70~400 / VCE(sat)=-0.3 V / AEC-Q101 / SOT-346
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    90663-1341 0906631341

Molex Electronics Ltd.
Part No. 90663-1341 0906631341
Description 2.54mm (.100") Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header
2.54mm (.100) Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header

File Size 184.47K  /  4 Page

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Amphenol Communications Solutions

Part No. 79821-162HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 62 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail.
Tech specs    

Official Product Page

    90663-1302 0906631302

Molex Electronics Ltd.
Part No. 90663-1302 0906631302
Description 2.54mm (.100") Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 30 Circuits
2.54mm (.100) Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 30 Circuits

File Size 184.37K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-5116-21D
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    90663-1301 0906631301

Molex Electronics Ltd.
Part No. 90663-1301 0906631301
Description 2.54mm (.100) Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers
2.54mm (.100) Pitch QF-50?/a> Vertical, MIL Keying with Latch/Eject Levers

File Size 184.37K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4116-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    90663-1141 0906631141

Molex Electronics Ltd.
Part No. 90663-1141 0906631141
Description 2.54mm (.100) Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 14 Circuits
2.54mm (.100") Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 14 Circuits

File Size 184.53K  /  4 Page

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Amphenol Communications Solutions

Part No. 77311-162-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    0906634503 90663-4503

Molex Electronics Ltd.
Part No. 0906634503 90663-4503
Description 2.54mm (.100) Pitch QF-50 Right Angle, MIL Keying with Latch/Eject Levers, Shrouded Header
2.54mm (.100") Pitch QF-50 Right Angle, MIL Keying with Latch/Eject Levers, Shrouded Header
MOLEX Connector

File Size 133.99K  /  3 Page

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Amphenol Communications Solutions

Part No. 10127721-162GLF
Description Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 16 Position, 3.2mm Kink Tail (Gold Flash) plating, GW Compatible LCP, Black Color,Tray Packing.
Tech specs    

Official Product Page

    0906636142 90663-6142

Molex Electronics Ltd.
Part No. 0906636142 90663-6142
Description 2.54mm (.100) Pitch QF-50 Right Angle, MIL Keying with Latch/Eject Levers, Shrouded Header, 14 Circuits
MOLEX Connector

File Size 154.33K  /  3 Page

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Amphenol Communications Solutions

Part No. 75168-116-20LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0906632163 90663-2163

Molex Electronics Ltd.
Part No. 0906632163 90663-2163
Description 2.54mm (.100) Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 16 Circuits
MOLEX Connector

File Size 143.77K  /  3 Page

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Amphenol Communications Solutions

Part No. 54242-811162350LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0906632203 90663-2203

Molex Electronics Ltd.
Part No. 0906632203 90663-2203
Description 2.54mm (.100) Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 20 Circuits
MOLEX Connector

File Size 143.76K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-3116-21D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    0906632263 90663-2263

Molex Electronics Ltd.
Part No. 0906632263 90663-2263
Description 2.54mm (.100) Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 26 Circuits
MOLEX Connector

File Size 143.77K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-8116-21D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

For 90663-1162 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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