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Molex Electronics Ltd.
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| Part No. |
87914-3616 0879143616
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray packaging, Lead-free
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| File Size |
3,779.41K /
48 Page |
 View
it Online |
Download Datasheet
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Molex Electronics Ltd.
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| Part No. |
87914-2216 0879142216
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray packaging, Lead-free
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| File Size |
3,779.50K /
48 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
0528304432 52830-4432
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| Description |
Modular Jack, Right Angle, 4/4, 0.76μm (30μ) Gold (Au) Plating, with Beveled MetalPins, Tray packaging, Lead-free
Modular Jack, Right Angle, 4/4, 0.76楼矛m (30楼矛") Gold (Au) Plating, with Beveled MetalPins, Tray packaging, Lead-free
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| File Size |
113.00K /
3 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
0528304422 52830-4422
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| Description |
Modular Jack, Right Angle, 4/4, 0.38渭m (15渭") Gold (Au) Plating, with Beveled MetalPins, Tray packaging, Lead-free
Modular Jack, Right Angle, 4/4, 0.38μm (15μ) Gold (Au) Plating, with Beveled MetalPins, Tray packaging, Lead-free
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| File Size |
112.82K /
3 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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