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  87834-3411 Datasheet PDF File

For 87834-3411 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    0878343419 87834-3419

Molex Electronics Ltd.
Part No. 0878343419 87834-3419
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 34 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator

File Size 115.43K  /  3 Page

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Amphenol Communications Solutions

Part No. 10131934-116ULF
Description Minitek®, Board to Board, Receptacle, Through Mount, Single row, 16 Positions, 2mm (0.079inch), Vertical.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0878343421 87834-3421

http://
Molex Electronics Ltd.
Part No. 0878343421 87834-3421
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating, Nylon Housing

File Size 124.52K  /  3 Page

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Amphenol Communications Solutions

Part No. 63411-102LF
Description Minitek® 2.00mm, Board to Board, Unshrouded Right Angled Header, Through Hole, Double Row, 16 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

    0878343441 87834-3441

Molex Electronics Ltd.
Part No. 0878343441 87834-3441
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating
2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13渭m (5渭) Gold (Au) Flash Plating

File Size 113.17K  /  3 Page

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Amphenol Communications Solutions

Part No. 68033-411HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
Tech specs    

Official Product Page

    0878343492 87834-3492

Molex Electronics Ltd.
Part No. 0878343492 87834-3492
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 34 Circuits, 0.13μm (5μ) Gold (Au) Plating, End Windows, with Pin 5 Voided

File Size 100.67K  /  3 Page

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Amphenol Communications Solutions

Part No. 70234-111LF
Description Metral® Board Connectors, Backplane Connectors, 4 Row Signal Header, 96 Position, Straight, Press-Fit, Wide body.
Tech specs    

Official Product Page

    0878343495 87834-3495

Molex Electronics Ltd.
Part No. 0878343495 87834-3495
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05μm (2μ) Gold (Au) Plating

File Size 115.69K  /  3 Page

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Amphenol Communications Solutions

Part No. IC13411011
Description ASSY,LYNX QD,Right Angle Plug,12Position Regular with guide pin & COND. LOSSY
Tech specs    

Official Product Page

    87834-5041 0878345041

Molex Electronics Ltd.
Part No. 87834-5041 0878345041
Description 2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13渭m (5渭) Gold (Au) Flash Plating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating

File Size 112.73K  /  3 Page

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Amphenol Communications Solutions

Part No. 133-411D-11H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 10 Column, Direct Orthogonal, Double End Wall, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    0878345045 87834-5045

Molex Electronics Ltd.
Part No. 0878345045 87834-5045
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 50 Circuits, 0.13μm (5μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 50 Circuits, 0.13渭m (5渭) Gold (Au) Selective Plating

File Size 120.74K  /  3 Page

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Amphenol Communications Solutions

Part No. 133-411F-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 14 Column, Direct Orthogonal, Double End Wall, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    0878341017

Molex Electronics Ltd.
Part No. 0878341017
Description 2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, Gold (Au) Flash, Polyester Housing

File Size 104.96K  /  3 Page

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Amphenol Communications Solutions

Part No. 20021834-11028T4LF
Description Minitek127®, Board to Board Stacking Header , Surface Mount, Double Row, 28 positions, 1.27mm (0.500in) pitch.
Tech specs    

Official Product Page

    87834-1011 0878341011

Molex Electronics Ltd.
http://
Part No. 87834-1011 0878341011
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 10 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

File Size 127.51K  /  3 Page

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Amphenol Communications Solutions

Part No. RJE1R288223411
Description Modular Jacks, Input Output Connectors, 8P8C, Cat5e, Stacked, Shield, With LEDs
Tech specs    

Official Product Page

    0878341021

Molex Electronics Ltd.
Part No. 0878341021
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating, Nylon Housing

File Size 124.35K  /  3 Page

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Amphenol Communications Solutions

Part No. G8233411YBPEU
Description Board mount - Header Receptacle - Box Header 2.0mm Pitch Vertical DIP,2x17Pin,Gold Flash,NY4T,Tail=2.5mm,With one Post,Color-Black,Tray
Tech specs    

Official Product Page

For 87834-3411 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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