| |
|
 |
Amphenol Communications Solutions |
| Part No. |
68461-432HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch, Right Angle, 10.16 mm (0.4 in.) Mating, 8.13 mm (0.32 in.) Tail
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
0757576401 75757-6401
|
| Description |
3.50mm (.138") Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, 1.5um (60u") Tin (Sn) Plating
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, 1.5um (60u) Tin (Sn) Plating
|
| File Size |
166.21K /
4 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
79821-432HLF
|
| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
0757576321 75757-6321
|
| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
|
| File Size |
166.28K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
68491-432HALF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 32 Positions, 2.54 mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
0757576281 75757-6281
|
| Description |
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 1.25渭m (50渭) Nickel (Ni) Overall, 2.50渭m (100渭) Minimum Select Matte Tin (Sn) Plating on Ta
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
|
| File Size |
166.28K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
10134214-320424CLF
|
| Description |
HPCE BTB RAH 36P24S WITH GUIDE
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
http://
|
| Part No. |
0757576181 75757-6181
|
| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 16 Circuits, 2.5μm(100μ) Tin (Sn) Plating, 27.77mm (1.093) Mating Pin Length, 3.05mm (.120) PC Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 2.5μm(100μ) Tin (Sn) Plating, 27.77mm (1.093) Mating Pin Length, 3.05mm (.120) PC Tail
|
| File Size |
166.21K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
10143267-127500ULF
|
| Description |
ExaMEZZ® 56Gb/s High Speed Mezzanine 2-pair, 19 column, 27.5mm stacking height, 152contacts
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
71991-432LF
|
| Description |
Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry, 64 Positions, 2.54mm (0.100in) Pitch
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
http://
|
| Part No. |
0757576131 75757-6131
|
| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 6 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 27.77mm (1.093) Mating Pin Length, 3.05mm (.120) PC Tail Length
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 6 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 27.77mm (1.093) Mating Pin Length, 3.05mm (.120) PC Tail Length
|
| File Size |
166.06K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
77311-432C10LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 10 Positions, 2.54 mm Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
http://
|
| Part No. |
0757576101 75757-6101
|
| Description |
3.50mm (.138") Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, 2.5um (100u") Tin (Sn) Plating
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, 2.5um (100u) Tin (Sn) Plating
|
| File Size |
166.22K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
78511-432HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
75757-6261 0757576261
|
| Description |
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 12 Circuits, 1.25μm(50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 12 Circuits, 1.25μm(50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on
|
| File Size |
166.28K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
68001-432HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 32 Positions, 2.54 mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
77311-432-04LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 04 Positions, 2.54 mm Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
|
Bom2Buy.com
Price and Availability
|
