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  61053-002 Datasheet PDF File

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    90-0021

Maxim Integrated Products
Part No. 90-0021
Description PACKAGE LAND PATTERN, (T2444-3 / T2444 3)

File Size 15.21K  /  1 Page

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Amphenol Communications Solutions

Part No. 54776-105-36LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 36 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    HS-7002

List of Unclassifed Manufacturers
ETC[ETC]
Electronic Theatre Controls, Inc.
Part No. HS-7002
Description PICMG BUS SINGLE BOARD COMPUTER

File Size 179.43K  /  1 Page

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    CUI INC
Part No. PJ-002A
Description DC POWER JACK

File Size 233.80K  /  3 Page

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    TELEDYNE[Teledyne Technologies Incorporated]
Part No. TMT-4-2002
Description Temperature Compensated Low Noise Amplifier 2 GHz - 4 GHz

File Size 888.15K  /  2 Page

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    Tripp Lite. All Rights ...
Part No. N002-003-GN
Description Cat5e 350MHz Molded Patch Cable (RJ45 M/M) - Green, 3-ft.

File Size 464.86K  /  2 Page

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    TELEDYNE[Teledyne Technologies Incorporated]
Part No. TMA-18-2002
Description Amplifier 2 GHz - 18 GHz

File Size 886.85K  /  2 Page

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    Tripp Lite. All Rights ...
Part No. N002-005-GN
Description Cat5e 350MHz Molded Patch Cable (RJ45 M/M) - Green, 5-ft.

File Size 475.45K  /  2 Page

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    CUI INC
Part No. PP3-002A
Description DC PLUG

File Size 14.66K  /  1 Page

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    Teledyne Technologies Incorporated.
TELEDYNE[Teledyne Technologies Incorporated]
Part No. TLA-18-2002
Description Low Noise Amplifier 2 GHz - 18 GHz

File Size 890.99K  /  2 Page

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    CGM-04-0002

Teledyne Technologies Incorporated
Part No. CGM-04-0002
Description Module Amplifier 0.5 GHz - 4 GHz

File Size 906.05K  /  2 Page

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