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  54122-405-30-0900 Datasheet PDF File

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    COSMO[COSMO Electronics Corporation]
Part No. CG1A090000
Description Outside Dimension:Unit(mm)

File Size 150.12K  /  1 Page

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Amphenol Communications Solutions

Part No. 54122-109080900LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0900590009 90059-0009

Molex Electronics Ltd.
Part No. 0900590009 90059-0009
Description 2.54mm (.100) Pitch C-Grid? Micro Shunt, Low Profile, 15mm Select Gold (Au) with Gold (Au) Flash Plating
2.54mm (.100) Pitch C-Grid庐 Micro Shunt, Low Profile, 15mm" Select Gold (Au) with Gold (Au) Flash Plating
MOLEX Connector

File Size 151.99K  /  2 Page

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Amphenol Communications Solutions

Part No. 54122-105460900LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 46 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0900590011 90059-0011

Molex Electronics Ltd.
Part No. 0900590011 90059-0011
Description 2.54mm (.100) Pitch C-Grid? Micro Shunt, Low Profile, 15mm Select Gold (Au) with Gold (Au) Flash Plating
2.54mm (.100) Pitch C-Grid庐 Micro Shunt, Low Profile, 15mm Select Gold (Au) with Gold (Au) Flash Plating
MOLEX Connector

File Size 152.69K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-106060900LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 6 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0190090004

Molex Electronics Ltd.
Part No. 0190090004
Description
File Size 60.76K  /  2 Page

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Amphenol Communications Solutions

Part No. 54122-105500900LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 50 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0190090002

Molex Electronics Ltd.
Part No. 0190090002
Description
File Size 60.92K  /  2 Page

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Amphenol Communications Solutions

Part No. 54122-108080900LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0900590007-17

Molex Electronics Ltd.
Part No. 0900590007-17
Description    2.54mm Pitch C-Grid Micro Shunt, Low Profile, 5.08μm Tin (Sn) Plating

File Size 22.61K  /  1 Page

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Amphenol Communications Solutions

Part No. 54122-106140900RLF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0900590013-17

Molex Electronics Ltd.
Part No. 0900590013-17
Description    2.54mm Pitch C-Grid Micro Shunt, Low Profile, 0.889μm Pre-tinned Plating

File Size 22.61K  /  1 Page

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Amphenol Communications Solutions

Part No. 54122-105240900LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 24 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0190090001

Molex Electronics Ltd.
Part No. 0190090001
Description
File Size 60.81K  /  2 Page

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Amphenol Communications Solutions

Part No. 54122-106120900LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 12 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0900590009-17

Molex Electronics Ltd.
Part No. 0900590009-17
Description    2.54mm Pitch C-Grid Micro Shunt, Low Profile, 0.381μm Select Gold (Au) with Gold (Au) Flash Plating

File Size 22.64K  /  1 Page

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Amphenol Communications Solutions

Part No. 54122-103140900LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    73809-0000 0738090000

Molex Electronics Ltd.
Part No. 73809-0000 0738090000
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board, Midplane Header, Vertical, Open End, NoGuide Post, No Polarization Key, 72 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board, Midplane Header, Vertical, Open End, NoGuide Post, No Polarization Key, 72 Circuits

File Size 158.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-105160900LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

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