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  1801 Datasheet PDF File

For 1801 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    44432-1801 0444321801

Molex Electronics Ltd.
Part No. 44432-1801 0444321801
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI?/a> Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 18 Circuits, Tin (Sn) Plating
3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 18 Circuits, Tin (Sn) Plating

File Size 224.08K  /  5 Page

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Amphenol Communications Solutions

Part No. 98401-801-28LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 28 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0923161801

Molex Electronics Ltd.
Part No. 0923161801
Description Picoflex PF-50 IDT-Board In, 18 Circuits, 1.0m (3.28 ) Length

File Size 96.90K  /  2 Page

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Amphenol Communications Solutions

Part No. 98401-801A34LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 34 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0193180110 193180110

Molex Electronics Ltd.
Part No. 0193180110 193180110
Description
File Size 127.28K  /  2 Page

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Amphenol Communications Solutions

Part No. 98401-801-50LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    44067-1801 0440671801

Molex Electronics Ltd.
Part No. 44067-1801 0440671801
Description 3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 18 Circuits, Tin (Sn) Plating
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 18 Circuits, Tin (Sn) Plating

File Size 203.94K  /  3 Page

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Amphenol Communications Solutions

Part No. 98401-801-20LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    2661021801

Fair-Rite Products Corp.
Part No. 2661021801
Description Higher Frequencies 250-1000 MHz

File Size 584.64K  /  5 Page

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Amphenol Communications Solutions

Part No. 87180-184C
Description Modular Jack, CAT 3, Low Profile, 8P4C, Right Angle, Through Mount, Without Shield, Snap Peg, 1 Port
Tech specs    

Official Product Page

    Hitachi
Part No. HA118010MP
Description 4-Channel Processor for Video Cameras

File Size 535.23K  /  9 Page

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Amphenol Communications Solutions

Part No. 77311-801-02LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 02 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    0447641801 44764-1801

Molex Electronics Ltd.
Part No. 0447641801 44764-1801
Description 3.00mm (.118") Pitch Micro-Fit 3.0, BMI Receptacle Header, Dual Row, Right Angle, with Press-fit Plastic Pegs
3.00mm (.118) Pitch Micro-Fit 3.0, BMI Receptacle Header, Dual Row, Right Angle, with Press-fit Plastic Pegs

File Size 244.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 77311-801-18LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    MAX1801 MAX1801EKA-T

MAXIM - Dallas Semiconductor
Maxim Integrated Products
Part No. MAX1801 MAX1801EKA-T
Description Digital Camera Step-Up Slave DC-DC Controller
From old datasheet system
Digital-Camera Step-Up Slave DC-DC Controller

File Size 277.10K  /  16 Page

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Amphenol Communications Solutions

Part No. 77311-801-35LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    PTF180101M

Infineon Technologies AG
Part No. PTF180101M
Description High Power RF LDMOS Field Effect Transistor 10 W, 1.0 鈥?2.0 GHz

File Size 299.94K  /  8 Page

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Amphenol Communications Solutions

Part No. 77311-801-06LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 06 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    B-106-1402 B-106-1502 B-106-1503 B-106-1601 B-106-1802 B-106-1803 B-106-1991 B-106-1403 B-106-1992 B-106-1602 B-106-1603

Tyco Electronics
Part No. B-106-1402 B-106-1502 B-106-1503 B-106-1601 B-106-1802 B-106-1803 B-106-1991 B-106-1403 B-106-1992 B-106-1602 B-106-1603 B-106-1801 B-106-1993 B-106-1501 B-106-1401 B-106-1502-S
Description DURASEAL RING TERMINAL

File Size 112.81K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-801-30LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

For 1801 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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