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  0440 Datasheet PDF File

For 0440 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    0440671401 44067-1401

Molex Electronics Ltd.
Part No. 0440671401 44067-1401
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
MOLEX Connector

File Size 204.10K  /  3 Page

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Amphenol Communications Solutions

Part No. 68604-407HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 7 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    44067-0401 0440670401

Molex Electronics Ltd.
Part No. 44067-0401 0440670401
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB

File Size 204.10K  /  3 Page

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Amphenol Communications Solutions

Part No. 51720-10104401AALF
Description PwrBlade®, Power Supply Connectors, 1P 44S 1P Right Angle Header.
Tech specs    

Official Product Page

    44067-1201 0440671201

Molex Electronics Ltd.
Part No. 44067-1201 0440671201
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 12 Circuits, Tin (Sn) Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, Tin (Sn) Plating

File Size 204.11K  /  3 Page

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Amphenol Communications Solutions

Part No. 10044002-001LF
Description SAS, Storage and Server Connector, Receptacle, Right Angle, Surface Mount, 29 Positions
Tech specs    

Official Product Page

    44067-0802 0440670802

Molex Electronics Ltd.
Part No. 44067-0802 0440670802
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick

File Size 204.16K  /  3 Page

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Amphenol Communications Solutions

Part No. 68004-400HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 1 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
Tech specs    

Official Product Page

    44067-0603 0440670603

Molex Electronics Ltd.
Part No. 44067-0603 0440670603
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")

File Size 204.16K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-804400750LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 40 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    44067-0601 0440670601

Molex Electronics Ltd.
Part No. 44067-0601 0440670601
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 6 Circuits, Tin (Sn) Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 6 Circuits, Tin (Sn) Plating

File Size 204.10K  /  3 Page

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Amphenol Communications Solutions

Part No. 10092044-001TRLF
Description Minitek® 2.00mm, Board To Board, Receptacle, Vertical, Surface Mount, Double Row, Top Entry, 36 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    44067-0403 0440670403

Molex Electronics Ltd.
Part No. 44067-0403 0440670403
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 4 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selectiv

File Size 204.16K  /  3 Page

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Amphenol Communications Solutions

Part No. 10044013-10110TLF
Description PCI Express® GEN 1 Card Edge, Storage and Server Connector, Vertical, Press-Fit, 280 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    44067-0402 0440670402

Molex Electronics Ltd.
Part No. 44067-0402 0440670402
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB

File Size 204.16K  /  3 Page

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Amphenol Communications Solutions

Part No. 10106263-2204401LF
Description PwrBlade+® , Power Connectors, 2LP+16S+2HP PF, Right Angle, Header.
Tech specs    

Official Product Page

    0440672002 44067-2002

Molex Electronics Ltd.
Part No. 0440672002 44067-2002
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for upto 3.56mm (.140) Thick PCB, 2 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 204.10K  /  3 Page

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Amphenol Communications Solutions

Part No. 54242-404401250LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    R2A30440NP-15

Renesas Electronics Corporation
Part No. R2A30440NP-15
Description 6-Channel Motor Driver IC for DSC, DVC and Surveillance Cameras

File Size 201.67K  /  7 Page

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Amphenol Communications Solutions

Part No. 10044002-002LF
Description SAS, Storage and Server Connector, Receptacle, Right Angle, Surface Mount, 29 Positions
Tech specs    

Official Product Page

For 0440 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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