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314750 1N5396 ON1263 FOD3180V XL1509 CEI122 4949ED LT1073
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  0031.8514-ND Datasheet PDF File

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    K100310

E-SWITCH
Part No. K100310
Description DIELECTRIC STRENGTH: 1,500 V @SEA LEVEL

File Size 181.30K  /  1 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TPCP8514
Description NPN Bipolar Transistor / VCEO=120 V / IC=3 A / hFE=120~240 / VCE(sat)=0.15 V / tf=170 ns / PS-8
Tech specs    

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HUA FENG CIRCUIT





   
Part No. E003122
Description From old datasheet system

File Size 134.70K  /  2 Page

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Amphenol Communications Solutions

Part No. 131-8514-21D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 4 Column, Left Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

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Part No. E003109
Description From old datasheet system

File Size 215.46K  /  4 Page

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Amphenol Communications Solutions

Part No. 77313-185-14LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 14 Positions
Tech specs    

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Part No. E003129
Description From old datasheet system

File Size 231.91K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-8514-21H
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 4 Column, Left Polarized, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

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Part No. E003131
Description From old datasheet system

File Size 237.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-8514-11D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 4 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

   
Part No. E003157
Description From old datasheet system

File Size 1,068.82K  /  25 Page

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Amphenol Communications Solutions

Part No. 10158514-0010SR1LF
Description Minitek® Multipitch™,1.5mm Crimp-to-Wire Connector Platform, Wire to Board Header, 10 Position, Top Latch, Tin (preplated)
Tech specs    

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Part No. E003158
Description From old datasheet system

File Size 443.20K  /  12 Page

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Amphenol Communications Solutions

Part No. 10158514-0009SR1LF
Description Minitek® Multipitch™,1.5mm Crimp-to-Wire Connector Platform, Wire to Board Header, 9 Position, Top Latch, Tin (preplated)
Tech specs    

Official Product Page

   
Part No. E003120
Description From old datasheet system

File Size 230.18K  /  4 Page

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Amphenol Communications Solutions

Part No. RJE591885141
Description Modular Jack - 8P8C, RA, Cat6, THT, Standard Profile, Single Port, Shield With Top and Side EMI Tabs, With LEDs
Tech specs    

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    pmc
Part No. 2000314
Description From old datasheet system

File Size 1,310.86K  /  240 Page

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Amphenol Communications Solutions

Part No. 10158514-0002SR1LF
Description Minitek® Multipitch™,1.5mm Crimp-to-Wire Connector Platform, Wire to Board Header, 2 Position, Top Latch, Tin (preplated)
Tech specs    

Official Product Page

    S6A0031

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. S6A0031
Description 8 COM / 80 SEG DRIVER & CONTROLLER FOR STN LCD

File Size 337.62K  /  37 Page

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Amphenol Communications Solutions

Part No. 10158514-0012SR1LF
Description Minitek® Multipitch™,1.5mm Crimp-to-Wire Connector Platform, Wire to Board Header, 12 Position, Top Latch, Tin (preplated)
Tech specs    

Official Product Page

For 0031.8514-ND Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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