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Agilent Technologies
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| Part No. |
MGA-61563
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| OCR Text |
... samples taken from 5 different wafers. Future wafers allocated to this product may have nominal values anywhere between upper and lower limits.
3
MGA-61563 Electrical Specifications Rbias=620ohm TC = 25C, ZO = 50, Vd = 3V (unless oth... |
| Description |
Low Noise Amplifier
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| File Size |
225.25K /
19 Page |
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Aptina Imaging Corporation
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| Part No. |
MT9N011
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| OCR Text |
...omer should transfer the dieor wafers to a similar environment for storage. aptina recommends the dieor wafers be maintained in a filtered nitrogen atmo- sphere until removed for assembly. the moistu re content of the storage facility sho... |
| Description |
9Mp CMOS Active-Pixel Digital Image Sensor Die
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| File Size |
743.70K /
17 Page |
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SGS Thomson Microelectronics
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| Part No. |
AN1068
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| OCR Text |
...me** wafer fabrication standard wafers* *pre-diffused wafers (selected products) wafer probing assembly final test shipment **wafer and assembly sites are typically located in different countries. ty p i c a l leadtime for standard pro... |
| Description |
MCUS - SELECTING BETWEEN ROM, FASTROM AND FLASH FOR A MICROCONTROLLER
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| File Size |
85.41K /
8 Page |
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EM Microelectronic
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| Part No. |
EMTCG256-3G
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| OCR Text |
... backlapped and distressed 8? wafers to 180 m options: sawn wafers on frame, modules development kit emulation platform (eme4652) fully integrated in keil uvision2 debugger with all debugging facilities starter kit em... |
| Description |
256KB Flash Smart Card IC Crypto
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| File Size |
144.27K /
3 Page |
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it Online |
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