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  TS3809-1011 Datasheet PDF File

For TS3809-1011 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    MJ11011

Inchange Semiconductor Company Limited
Part No. MJ11011
Description isc Silicon PNP Darlington Power Transistor
File Size 49.38K  /  2 Page

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Rochester Electronics LLC
Part No. BLA1011-300
Description BLA1011-300 - 300W LDMOS Avionics Power Transistor
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    2SA1011

Savantic, Inc.
Part No. 2SA1011
Description Silicon PNP Power Transistors
File Size 146.09K  /  4 Page

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Amphenol Communications Solutions
Part No. 10114831-10115LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

    2SA1011 2SA1011-15

Quanzhou Jinmei Electro...
Quanzhou Jinmei Electronic Co.,Ltd.
Part No. 2SA1011 2SA1011-15
Description Silicon PNP Power Transistors
File Size 94.34K  /  4 Page

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Amphenol Communications Solutions
Part No. 10118085-101-10LF
Description Unshrouded Right Angle Header, Surface Mount With Peg, Double row , 10 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

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    EIM1011-4

Excelics Semiconductor, Inc.
Part No. EIM1011-4
Description 10.7-11.7GHz Multi-Stage Power Amplifier
File Size 153.76K  /  4 Page

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Amphenol Communications Solutions
Part No. 10114831-10112LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 12 POSITIONS, TIN PLATING
Tech specs 　 　

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    EIC1011-12

Excelics Semiconductor, Inc.
Part No. EIC1011-12
Description 10.7-11.7 GHz 12-Watt Internally Matched Power FET
File Size 91.96K  /  2 Page

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Amphenol Communications Solutions
Part No. 10114829-10113LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 13 Positions
Tech specs 　 　

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    1321011-06

Qualtek Electronics Corporation
Part No. 1321011-06
Description DVI (12 5)P/M - HD15P/M
File Size 447.03K  /  1 Page

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Amphenol Communications Solutions
Part No. 10114828-10113LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 13 Positions
Tech specs 　 　

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    Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TIM1011-5L
Description MICROWAVE POWER GaAs FET
File Size 133.39K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114830-10113LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 13 Positions
Tech specs 　 　

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    Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TIM1011-4L
Description MICROWAVE POWER GaAs FET
File Size 145.86K  /  4 Page

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Amphenol Communications Solutions
Part No. 10114831-10111LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 11 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

    EIC1011-4

Excelics Semiconductor, Inc.
Part No. EIC1011-4
Description 10.70-11.70GHz 4-Watt Internally-Matched Power FET
File Size 153.16K  /  4 Page

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Amphenol Communications Solutions
Part No. 10114830-10112LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 12 Positions
Tech specs 　 　

Official Product Page

    EIC1011-8

Excelics Semiconductor, Inc.
Part No. EIC1011-8
Description 10.70-11.70GHz 8-Watt Internally Matched Power FET
File Size 114.37K  /  2 Page

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Amphenol Communications Solutions
Part No. 10118085-101-12LF
Description Unshrouded Right Angle header,Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

For TS3809-1011 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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