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  TES1-0513 Datasheet PDF File

For TES1-0513 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    0513382674

Molex Electronics Ltd.
Part No. 0513382674
Description 0.40mm (.016) Pitch Board-to-Board SlimStack Receptacle, Surface Mount, DualRow, Vertical Stacking, 1.50mm (.059) Stacking Height, with Space Saving J-BendLeads, 26 Circuits, Lead-free

File Size 509.42K  /  8 Page

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Amphenol Communications Solutions

Part No. 68405-130HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0513531400 51353-1400

Molex Electronics Ltd.
Part No. 0513531400 51353-1400
Description 2.00mm (.079) Pitch MicroClasp Wire-to-Board Receptacle Housing, Positive LockDual Row, 14 circuits

File Size 222.75K  /  3 Page

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Amphenol Communications Solutions

Part No. 68705-131HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 31 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0513383474 51338-3474

Molex Electronics Ltd.
Part No. 0513383474 51338-3474
Description 0.40mm (.016) Pitch Board-to-Board SlimStack Receptacle, Surface Mount, DualRow, Vertical Stacking, 1.50mm (.059) Stacking Height, with Space Saving J-BendLeads, 34 Circuits, Lead-free

File Size 510.06K  /  8 Page

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Amphenol Communications Solutions

Part No. U95Z2454051301
Description ULTQSFP 2X2 COMBO 4LP&SPFG
Tech specs    

Official Product Page

    51338-0274 0513380274

Molex Electronics Ltd.
Part No. 51338-0274 0513380274
Description 0.40mm (.016) Pitch Board-to-Board SlimStack Receptacle, Surface Mount, DualRow, Vertical Stacking, 1.50mm (.059) Stacking Height, with Space Saving J-BendLeads, 20 Circuits, Lead-free

File Size 509.53K  /  8 Page

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Amphenol Communications Solutions

Part No. 98426-G04-05-133LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 10 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    51338-0674 0513380674

Molex Electronics Ltd.
Part No. 51338-0674 0513380674
Description 0.40mm (.016) Pitch Board-to-Board SlimStack Receptacle, Surface Mount, Dual Row, Vertical Stacking, with Space Saving J-Bend Leads, 60 Circuits, Lead-free

File Size 510.05K  /  8 Page

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Amphenol Communications Solutions

Part No. 73305-131LF
Description RJ45 Modular Jack, Input Output Connectors, CAT 3, Standard, 6P6C, Right Angle, Surface Mount, without Shield, 1 Port.
Tech specs    

Official Product Page

    51338-0574 0513380574

Molex Electronics Ltd.
Part No. 51338-0574 0513380574
Description 0.40mm (.016) Pitch Board-to-Board SlimStack Receptacle, Surface Mount, DualRow, Vertical Stacking, 1.50mm (.059) Stacking Height, with Space Saving J-BendLeads, 50 Circuits, Lead-free

File Size 509.42K  /  8 Page

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Amphenol Communications Solutions

Part No. 68705-130HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    51338-2274 0513382274

Molex Electronics Ltd.
Part No. 51338-2274 0513382274
Description 0.40mm (.016) Pitch Board-to-Board SlimStack Receptacle, Surface Mount, Dual Row, Vertical Stacking, 1.50mm (.059) Stacking Height, with Space Saving J-Bend Leads, 22 Circuits, Lead-free

File Size 510.13K  /  8 Page

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Amphenol Communications Solutions

Part No. 54121-407051300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    51336-1910 0513361910

Molex Electronics Ltd.
Part No. 51336-1910 0513361910
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 19 Circuits

File Size 98.92K  /  2 Page

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Amphenol Communications Solutions

Part No. 10120513-002C-TRLF
Description SAS/PCIe 3.0 (U.2) Connectors, Storage and Server Connector, 68 Position Vertical Recep SMT, 12Gb/s.
Tech specs    

Official Product Page

    0513361310 51336-1310

Molex Electronics Ltd.
Part No. 0513361310 51336-1310
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 13Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 13Circuits
MOLEX Connector

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 54102-S0513B03LF
Description BERGSTIK 0.100\\ HEADER-REPLACMNT 77313-801-26LF
Tech specs    

Official Product Page

    0513470600 51347-0600

Molex Electronics Ltd.
Part No. 0513470600 51347-0600
Description 3.30mm (.130) Pitch Wire-to-Wire Receptacle Housing, Positive Lock, Dual Row, 6Circuits
3.30mm (.130") Pitch Wire-to-Wire Receptacle Housing, Positive Lock, Dual Row, 6Circuits

File Size 218.83K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-807051300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For TES1-0513 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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