| |
|
 |
Mitsubishi Electric Sem...
MITSUBISHI[Mitsubishi Electric Semiconductor]
|
| Part No. |
RA08N1317M_06 RA08N1317M RA08N1317M-101 RA08N1317M06
|
| OCR Text |
... a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated wi...ceramic substrate in the module to crack by bending forces, either immediately when driving screws o... |
| Description |
RoHS Compliance , 135-175MHz 8W 9.6V, 2 Stage Amp. For PORTABLE RADIO
|
| File Size |
92.10K /
8 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Mitsubishi Electric Semicon...
MITSUBISHI[Mitsubishi Electric Semiconductor]
|
| Part No. |
RA13H1317M_06 RA13H1317M RA13H1317M-101 RA13H1317M06
|
| OCR Text |
... a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated wi...ceramic substrate in the module to crack by bending forces, either immediately when driving screws o... |
| Description |
RoHS Compliance , 135-175MHz 13W 12.5V, 2 Stage Amp. For MOBILE RADIO
|
| File Size |
103.73K /
8 Page |
View
it Online |
Download Datasheet |
| |
|
|
MITSUBISHI[Mitsubishi Electric Semiconductor]
|
| Part No. |
RA13H3340M_06 RA13H3340M RA13H3340M-101 RA13H3340M06
|
| OCR Text |
... a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated wi...ceramic substrate in the module to crack by bending forces, either immediately when driving screws o... |
| Description |
RoHS Compliance , 330-400MHz 13W 12.5V, 2 Stage Amp. For MOBILE RADIO
|
| File Size |
92.90K /
8 Page |
View
it Online |
Download Datasheet |
| |
|
|
MITSUBISHI[Mitsubishi Electric Semiconductor]
|
| Part No. |
RA13H4047M_06 RA13H4047M RA13H4047M-101 RA13H4047M06
|
| OCR Text |
... a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated wi...ceramic substrate in the module to crack by bending forces, either immediately when driving screws o... |
| Description |
RoHS Compliance , 400-470MHz 13W 12.5V, 2 Stage Amp. For MOBILE RADIO
|
| File Size |
93.46K /
8 Page |
View
it Online |
Download Datasheet |
| |
|
|
Mitsubishi Electric Semicon...
MITSUBISHI[Mitsubishi Electric Semiconductor]
|
| Part No. |
RA13H4452M_06 RA13H4452M RA13H4452M-101 RA13H4452M06
|
| OCR Text |
... a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated wi...ceramic substrate in the module to crack by bending forces, either immediately when driving screws o... |
| Description |
RoHS Compliance , 440-520MHz 13W 12.5V, 2 Stage Amp. For MOBILE RADIO
|
| File Size |
91.50K /
8 Page |
View
it Online |
Download Datasheet |
| |
|
|
Mitsubishi Electric Sem...
MITSUBISHI[Mitsubishi Electric Semiconductor]
|
| Part No. |
RA18H1213G_06 RA18H1213G RA18H1213G-101 RA18H1213G06
|
| OCR Text |
... a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated wi...ceramic substrate in the module to crack by bending forces, either immediately when driving screws o... |
| Description |
RoHS Compliance , 1.24-1.30GHz 18W 12.5V, 3 Stage Amp. For MOBILE RADIO
|
| File Size |
105.59K /
8 Page |
View
it Online |
Download Datasheet |
| |
|
|
MITSUBISHI[Mitsubishi Electric Semiconductor]
|
| Part No. |
RA30H0608M_06 RA30H0608M RA30H0608M-101 RA30H0608M06
|
| OCR Text |
... a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated wi...ceramic substrate in the module to crack by bending forces, either immediately when driving screws o... |
| Description |
RoHS Compliance , 66-88MHz 30W 12.5V, 2 stage Amp. for MOBILE RADIO
|
| File Size |
95.56K /
8 Page |
View
it Online |
Download Datasheet |
| |
|
|
MITSUBISHI[Mitsubishi Electric Semiconductor]
|
| Part No. |
RA30H1317M_06 RA30H1317M RA30H1317M-101 RA30H1317M06
|
| OCR Text |
... a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated wi...ceramic substrate in the module to crack by bending forces, either immediately when driving screws o... |
| Description |
RoHS Compliance , 135-175MHz 30W 12.5V 2 Stage Amp. For MOBILE RADIO
|
| File Size |
91.18K /
8 Page |
View
it Online |
Download Datasheet |
|
Price and Availability
|
