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    HITTITE[Hittite Microwave Corporation]
Part No. HMC448
OCR Text ...tems. Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nit...
Description GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 19 - 25 GHz OUTPUT

File Size 222.03K  /  6 Page

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    HITTITE[Hittite Microwave Corporation]
Part No. HMC449
OCR Text ...tems. Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nit...
Description GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 27 - 33 GHz OUTPUT

File Size 221.78K  /  6 Page

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    HP7501-T28 HP7501 HP7501-A36

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ETC[ETC]
Part No. HP7501-T28 HP7501 HP7501-A36
OCR Text ...ncy noise. Capacitors should be placed as close as possible to the HP7501. The HP7501 should be placed as close as possible to the SCSI connector to minimize input signal trace length and result in less reflections and better performance. T...
Description Ultra320 LVD/SE SCSI Terminator

File Size 198.90K  /  9 Page

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    IRF[International Rectifier]
Part No. IRPLLNR3
OCR Text ...mode filament heating (filament placed inside L-C tank) will result in excessive filament current during running. The output stage has therefore been configured for voltage-mode filament heating using secondary windings off of the resonant ...
Description Universal Input Linear Fluorescent Ballast using the IR2167

File Size 322.89K  /  27 Page

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    LODEV[LOGIC Devices Incorporated]
Part No. LF3304QC15 LF3304 LF3304QC10 LF3304QC12
OCR Text ...to 4097 clock cycles. The value placed on LENGTH11-0 is equal to the desired delay minus 8. To set the length of RAM Array A TABLE 1. DEVICE CONFIGURATION MODE1-0 0 0 1 1 0 1 0 1 Mode Select Dual Line Buffer Cascaded Line Buffer Dual FI...
Description Dual Line Buffer/FIFO

File Size 129.65K  /  12 Page

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    MICROSEMI[Microsemi Corporation]
Part No. LX1725
OCR Text ...-coupling capacitance should be placed between VPOS2 and VNEG2. PWM output for channel 2. This pin drives the L-C low pass filter prior to driving the speaker. Negative voltage supply to channel 2's output buffer. In a split supply system, ...
Description 15W+15W Stereo Class-D Amplifier Filterless 30W Mono in BTL

File Size 374.18K  /  23 Page

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    MOTOROLA[Motorola, Inc]
Part No. MCM62Y308J17 MCM62Y308
OCR Text ...put side of the serial register placed between TDI and TDO. The register placed between TDI and TDO is determined by the state of the TAP state machine and what instruction is active in the TAP instruction register. This circuit is designed...
Description Synchronous Line Buffer:8K x 8 Bit Fast Static Dual Ported Memory

File Size 257.37K  /  16 Page

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