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For particles Found Datasheets File :: 886 Search Time::0.954ms
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				Mitsubishi Electric, Corp. MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No.	RA13H1317M RA13H1317M-E01 RA13H1317M-01
OCR Text	...a heat sink that is not flat or particles between module and heat sink may cause the ceramic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A the...
Description	135-175MHz 13W 12.5V MOBILE RADIO 135 - 175MHz3W 12.5V移动通信
File Size	66.31K / 9 Page	View it Online	Download Datasheet

				Mitsubishi Electric, Corp. MITSUBISHI[Mitsubishi Electric Semiconductor] Mitsubishi Electric Corporation
Part No.	RA13H4047M RA13H4047M-01 RA13H4047M-E01
OCR Text	...a heat sink that is not flat or particles between module and heat sink may cause the ceramic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A the...
Description	30V N-Channel PowerTrench MOSFET 30V的N沟道的PowerTrench MOSFET MITSUBISHI RF MOSFET MODULE 400-470MHz 13W 12.5V 2 Stage Amp. For MOBILE RADIO MITSUBISHI RF MOSFET MODULE 400-470MHz 13W 12.5V, 2 Stage Amp. For MOBILE RADIO MITSUBISHI RF MOSFET MODULE 400-470MHz 13W 12.5V/ 2 Stage Amp. For MOBILE RADIO
File Size	84.04K / 9 Page	View it Online	Download Datasheet

				Mitsubishi Electric, Corp. MITSUBISHI[Mitsubishi Electric Semiconductor] Mitsubishi Electric Corporation
Part No.	RA30H2127M RA30H2127M-01 RA30H2127M-E01
OCR Text	...a heat sink that is not flat or particles between module and heat sink may cause the ceramic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A the...
Description	210-270MHz 30W 12.5V MOBILE RADIO 210 - 270MHz功率30W 12.5V移动通信
File Size	57.86K / 8 Page	View it Online	Download Datasheet

				Mitsubishi Electric, Corp. MITSUBISHI[Mitsubishi Electric Semiconductor] Mitsubishi Electric Corporation
Part No.	RA30H4047M RA30H4047M-01 RA30H4047M-E01
OCR Text	...a heat sink that is not flat or particles between module and heat sink may cause the ceramic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A the...
Description	400-470MHz 30W 12.5V MOBILE RADIO 400 - 470MHz的功0W 12.5V移动通信
File Size	65.93K / 9 Page	View it Online	Download Datasheet

				Philips
Part No.	CGY2032BTS CGY2032BTS_2
OCR Text	...te (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for ...
Description	DECT 500 mW power amplifier From old datasheet system
File Size	73.43K / 12 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	IRPT1057A 2398
OCR Text	...57A power module. 2. Remove all particles and grit from the heat sink and power substrate. 3. Spread a .004" to .005" layer of silicone grease on the heat sink, covering the entire area that the power substrate will occupy. Recommended heat...
Description	Power Module for 0.75 hp Motor Drives From old datasheet system
File Size	212.96K / 12 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	IRPT1057 2397
OCR Text	...ctions Mounting 1. Remove all particles and grit from the heat sink and power substrate. 2. Spread a .004" to .005" layer of silicone grease on the heat sink, covering the entire area that the power substrate will occupy. Recommended heat...
Description	Integrated Power Stage for 0.75 hp Motor Drives From old datasheet system
File Size	348.06K / 12 Page	View it Online	Download Datasheet

				IRF[International Rectifier]
Part No.	IRPT5051 2422 IRPT5051E IRPT5051A IRPT5051C IRPT5051D
OCR Text	...A power assembly. 1. Remove all particles and grit from the heat sink and power substrate. 2. Spread a .004" to .005" layer of silicone grease on the heat sink, covering the entire area that the power substrate will occupy. 3. Place the pow...
Description	From old datasheet system Integrated Power Stage for 15 hp Motor Drives
File Size	400.98K / 12 Page	View it Online	Download Datasheet

				Philips
Part No.	TDA7010T TDA7010T_CNV_2 TDA7010T/V3
OCR Text	...te (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; f...
Description	TDA7010T; FM radio circuit From old datasheet system
File Size	176.06K / 11 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	BGY1816S
OCR Text	...t and free from burrs and loose particles. The heatsink should be rigid and not prone to bowing under thermal cycling conditions. The thickness of a solid heatsink should be not less than 5 mm to ensure a rigid assembly. A thin, even layer ...
Description	UHF amplifier module
File Size	67.96K / 12 Page	View it Online	Download Datasheet

For particles Found Datasheets File :: 886 Search Time::0.954ms
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