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  MADP-030015-1314 Datasheet PDF File

For MADP-030015-1314 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    W91316 W91314 W91314A W91312A W91310

Winbond Electronics Corp
Part No. W91316 W91314 W91314A W91312A W91310
Description Tone/Pulse Dialer With Redial Function(具有重拨功能的音脉冲拨号

File Size 211.71K  /  12 Page

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Amphenol Communications Solutions

Part No. 131-4114-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    MC1312P MC1314P MC1315P

Motorola, Inc
Part No. MC1312P MC1314P MC1315P
Description CBS SQ LOGIC DECODER SYSTEM

File Size 383.91K  /  12 Page

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Amphenol Communications Solutions

Part No. 131-4416-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    MADP-042905-13060 MADP-042905-13060G MADP-042905-13060P MADP-042905-13060T MADP-042405-13060 MADP-042405-13060G MADP-042

M/A-COM Technology Solutions, Inc.
Part No. MADP-042905-13060 MADP-042905-13060G MADP-042905-13060P MADP-042905-13060T MADP-042405-13060 MADP-042405-13060G MADP-042405-13060P MADP-042405-13060T MADP-042505-13060 MADP-042505-13060G MADP-042505-13060P MADP-042505-13060T MADP-042305-13060G MADP-042305-13060P MADP-042305-13060T MADP-042305-13060
Description SURMOUNTTM PIN Diodes

File Size 127.92K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4118-11H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    MA4AGP9072 MADP-001907-13050P

M/A-COM Technology Solutions, Inc.
http://
M/A-COM Technology Solution...
Part No. MA4AGP9072 MADP-001907-13050P
Description AlGaAs Flip Chip PIN Diodes

File Size 119.59K  /  6 Page

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Amphenol Communications Solutions

Part No. 131-4514-11H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Left Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    MACOM[Tyco Electronics]
Part No. MADP-042905-130600 MADP-042005-S MADP-042305-130600 MADP-042405-130600 MADP-042505-130600
Description SURMOUNT TM 5 μm PIN Diodes
SURMOUNT TM 5 レm PIN Diodes

File Size 72.62K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4216-21D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Double End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    PT21311 PT21312 PT21313 PT21314 PT21315

Datatronic Distribution, Inc.
Part No. PT21311 PT21312 PT21313 PT21314 PT21315
Description 10BASE-T Isolation Modules in PCMCIA package

File Size 49.05K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-4518-21D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Left Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    0901301314 90130-1314

Molex Electronics Ltd.
http://
Part No. 0901301314 90130-1314
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 14 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Vertical, Shrouded, Fully Loaded, 14 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 585.97K  /  7 Page

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Amphenol Communications Solutions

Part No. 131-4314-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Left End Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    90147-1314 0901471314

Molex Electronics Ltd.
Part No. 90147-1314 0901471314
Description 2.54mm (.100) Pitch C-Grid? PC Board Connector, Single Row, Vertical, 14 Circuits

File Size 169.44K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4616-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right Polarized, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    0026613140

Molex Electronics Ltd.
Part No. 0026613140
Description 3.96mm (.156") Pitch KK Solid Header, Right Angle, without Peg, 14 Circuits, Gold (Au) Plating

File Size 245.57K  /  10 Page

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Amphenol Communications Solutions

Part No. 131-4316-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Left End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    53313-1465 0533131465

Molex Electronics Ltd.
Part No. 53313-1465 0533131465
Description 2.00mm (.079) Pitch Mi ll System Wire-to-Board Header, Dual Row, Vertical, Leadfree14 Circuits

File Size 123.99K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-4618-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

For MADP-030015-1314 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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