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For layers Found Datasheets File :: 5673    Search Time::5.953ms    
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    AD7015 AD20MSP410 AD53_009-9 ADSP-2178-780244 ADPLP01 AD53/009-9

Analog Devices, Inc.
http://
AD[Analog Devices]
Part No. AD7015 AD20MSP410 AD53_009-9 ADSP-2178-780244 ADPLP01 AD53/009-9
OCR Text ...ion, an object code license for layers 2 and 3 of the protocol stack is available. This exact package of layers 1,2,3 of software, coupled with the AD20msp410 chipset, is today in phones that have passed European GSM Final Type Approval. A...
Description GSM Baseband Processing Chipset SPECIALTY TELECOM CIRCUIT, PQFP80

File Size 58.39K  /  8 Page

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    IRDC3624

International Rectifier
Part No. IRDC3624
OCR Text ...ayer. figure 2 C top and bottom layers of the ir3624 evaluation board. power supply decoupling capacitors, the charge pump capacitor and feedback components are located close to the ir3624 ic. the feedback resistors are connected to t...
Description High Performance Synchronous Buck Controller in a small 8-pin SOIC

File Size 522.92K  /  9 Page

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    RC2200 RC2202 RC2204 RC220X RC2200AT RC2200MM RC2202AT RC2204AT RC2202MM RC2204MM

Electronic Theatre Controls, Inc.
List of Unclassifed Manufacturers
List of Unclassifed Man...
Part No. RC2200 RC2202 RC2204 RC220X RC2200AT RC2200MM RC2202AT RC2204AT RC2202MM RC2204MM
OCR Text ... 802.15.4 compliant PHY and MAC layers providing 16 channels in the 2.45 GHz world-wide license-free ISM band. The complete shielded module is only 16.5 x 29.2 x 3.5 mm, optionally available with integrated antenna or RF connector. Up to 12...
Description    ZigBee Ready RF Transceiver Modules

File Size 374.60K  /  17 Page

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    Linear Technology, Corp.
Part No. 22274
OCR Text ...iew DMS is broken up into four layers: the application layer, the cell layer, the block layer, and the device layer. These layers interact with each other, maintaining a minimum level of coupling and a maximum level of data abstraction. Th...
Description Data Management Software (DMS) for AMD Simultaneous Read/Write Flash Memory Devices 数据管理软件(简称DMS)为AMD同步写闪存设

File Size 159.80K  /  10 Page

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    ECG050B-G ECG050B-PCB ECG050C-PCB

List of Unclassifed Manufacturers
Electronic Theatre Controls, Inc.
WJ Communications
Part No. ECG050B-G ECG050B-PCB ECG050C-PCB
OCR Text ... as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. ...
Description InGaP HBT Gain Block

File Size 311.09K  /  7 Page

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    GENNUM[Gennum Corporation]
Part No. EB9035
OCR Text ...by 4.5". Ground and power plane layers are internal to the board with signal layers on the top and bottom of the board. Components are mounted both on the top and bottom sides. The silkscreen (top and bottom) and all four layers are shown o...
Description GENLINX-TM II EB9035 Evaluation Board

File Size 181.51K  /  9 Page

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    GENNUM[Gennum Corporation]
Part No. EB9024
OCR Text ...y 3.25". Ground and power plane layers are internal to the board with signal layers on the top and SERIAL DATA INPUT GS9024 EQUALIZER GS9028 CABLE DRIVER SERIAL DATA OUTPUTS EB9024 BLOCK DIAGRAM Document No. VB2932 - 1 ...
Description GENLINX-TM II EB9024 Evaluation Board

File Size 113.20K  /  9 Page

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    GENNUM[Gennum Corporation]
Part No. EB9021
OCR Text ...by 4.5". Ground and power plane layers are internal to the board with signal layers on the top and bottom of the board. Components are mounted on the top side. The silk-screen (top) and the top and bottom layers are shown on the following p...
Description GENLINX-TM II EB9021 Evaluation Board

File Size 410.06K  /  8 Page

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    EVB-USB2513Q36-BAS

SMSC Corporation
Part No. EVB-USB2513Q36-BAS
OCR Text ...-layer design: two outer signal layers - power inner layers - ground inner layers Optional pull-up resistors for disabling individual downstream ports. Self-powered operation. Multi-transaction translator enabled. Supports internal default ...
Description
File Size 259.51K  /  6 Page

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    ICST
Part No. ICS557-06
OCR Text ...izing vias through other signal layers (the ferrite bead and bulk decoupling capacitor can be mounted on the back). Other signal traces should be routed away from the ICS557-06. This includes signal traces just underneath the device, or on ...
Description ONE TO FOUR HCSL CLOCK BUFFER

File Size 214.93K  /  10 Page

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