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  HOA1180-003 Datasheet PDF File

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    2003

GHZ Technology
Part No. 2003
Description Case Outline 55BT-1 / Style 1

File Size 156.98K  /  3 Page

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HUA FENG CIRCUIT





    890-003 890-004

Glenair, Inc.
Part No. 890-003 890-004
Description Single Row Uninsulated Wire Pigtail Assemblies

File Size 114.33K  /  2 Page

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    MILL-MAX MFG CORP
Part No. 0038-3-17-01-30-27-02-0
Description BERYLLIUM COPPER, GOLD (30) OVER NICKEL FINISH, PCB TERMINAL

File Size 136.83K  /  2 Page

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    MILL-MAX MFG CORP
Part No. 0038-3-17-15-30-27-02-0
Description BERYLLIUM COPPER, GOLD (30) OVER NICKEL FINISH, PCB TERMINAL

File Size 139.62K  /  2 Page

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    14-60-0034

Molex Electronics Ltd.
Part No. 14-60-0034
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female,Single Row, Version G, Positive Lock, Wire Size 26, 3.81μm (150μ) Tin/Lead (SnPb),3 Circuits

File Size 165.55K  /  3 Page

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    List of Unclassifed Man...
Part No. 3003-13
Description KNOB

File Size 72.36K  /  1 Page

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    90-0035

Maxim Integrated Products
Part No. 90-0035
Description PACKAGE LAND PATTERN, (T2844-1 / T2844 1)

File Size 15.12K  /  1 Page

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    90-0032

Maxim Integrated Products
Part No. 90-0032
Description PACKAGE LAND PATTERN, (T1633-5 / T1633 5)

File Size 15.08K  /  1 Page

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    AN-0003

ANADIGICS, Inc
Part No. AN-0003
Description Thermal Considerations for Power Amplifiers

File Size 306.11K  /  6 Page

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    22-28-0031

Molex Electronics Ltd.
Part No. 22-28-0031
Description 2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, with Friction Lock, 3 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Vertical, with Friction Lock, 3 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 55.69K  /  5 Page

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