HFD27 003-S pdf Datasheet P13 Part Num --- IC-ON-LINE


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HFD27 003-S Datasheet PDF File

For HFD27 003-S Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |

				Molex, Inc.
Part No.	39-00-0038
Description	Crimp Socket Contact; Wire Size (AWG):18-24; Contact Material:Brass; Contact Plating:Tin; Contact Termination:Crimp BRASS, TIN OVER COPPER FINISH, WIRE TERMINAL
File Size	163.11K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	22-28-0036
Description	KK? 254 Breakaway Header, Vertical, with Friction Lock, 3 Circuits, Tin (Sn) Plating, with Back walls Removed
File Size	66.24K / 2 Page	View it Online	Download Datasheet

				Asahi Kasei Microsystem...
Part No.	MS-0030
Description	Semiconductor Magnetoresistive Element
File Size	386.25K / 8 Page	View it Online	Download Datasheet

				List of Unclassifed Manufacturers
Part No.	627-000-003
Description	627 SERIES SUBMINIATURE D CONNECTOR PLUG(PIN) VERTICAL PCB, METAL BODY
File Size	207.33K / 2 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	22-28-0034
Description	2.54mm (.100) Pitch KK庐 Header, Breakaway, Vertical, with Friction Lock, 3 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, with Kinked PC Tails 2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, with Friction Lock, 3 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Kinked PC Tails
File Size	167.52K / 6 Page	View it Online	Download Datasheet

For HFD27 003-S Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |