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  heating cooling Datasheet PDF File

For heating cooling Found Datasheets File :: 3432    Search Time::1.703ms    
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    MMFT2406T1 MMFT2406T MMFT2406T1_D ON2217

Motorola Mobility Holdings, Inc.
ON Semi
MOTOROLA[Motorola, Inc]
Part No. MMFT2406T1 MMFT2406T MMFT2406T1_D ON2217
OCR Text ...data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C. * The soldering temp...cooling should be used as the use of forced cooling will increase the temperature gradient and resul...
Description MEDIUM POWER TMOS FET 700 mA 240 VOLTS 0.7 A, 240 V, 6 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-261AA
N-hannel Enhancement-ode Logic Level SOT23
From old datasheet system

File Size 87.87K  /  6 Page

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    MSD42WT1 ON2379

MOTOROLA[Motorola, Inc]
Part No. MSD42WT1 ON2379
OCR Text ...data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C. * The soldering temp...cooling should be used as the use of forced cooling will increase the temperature gradient and resul...
Description From old datasheet system
NPN GENERAL PURPOSE HIGH VOLTAGE TRANSISTORS SURFACE MOUNT

File Size 74.51K  /  4 Page

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    B32559S8123 B32559S8223 B32559S8273 B32559S8103 B32559S8153 B32559S8183 B32559S8562

EPCOS
Part No. B32559S8123 B32559S8223 B32559S8273 B32559S8103 B32559S8153 B32559S8183 B32559S8562
OCR Text ...pend on other factors like: Pre-heating temperature and time Forced cooling immediately after soldering Terminal characteristics: diameter, length, thermal resistance, special configurations (e.g. crimping) Height of capacitor above solder ...
Description Film Capacitors Metallized Polyester Film Capacitors

File Size 322.70K  /  18 Page

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    B3291110 B32912A3104 B32912A3154 B32912A3223 B32912A3224 B32914B3684 B32914A3105 B32914A3155 B32911A3103 B32911B3223 B32

EPCOS
Part No. B3291110 B32912A3104 B32912A3154 B32912A3223 B32912A3224 B32914B3684 B32914A3105 B32914A3155 B32911A3103 B32911B3223 B32911A3333 B32912B3154 B32912B3334 B32912B3224
OCR Text ...pend on other factors like: Pre-heating temperature and time Forced cooling immediately after soldering Terminal characteristics: diameter, length, thermal resistance, special configurations (e.g. crimping) Height of capacitor above solder ...
Description Film Capacitors EMI Suppression Capacitors (MKP)

File Size 316.50K  /  17 Page

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    B329321008 B32936A3105 B32936A3106M B32936A3155 B32936A3225 B32936A3335 B32936A3475 B32936A3685 B32934D3155 B32934A3824

EPCOS
Part No. B329321008 B32936A3105 B32936A3106M B32936A3155 B32936A3225 B32936A3335 B32936A3475 B32936A3685 B32934D3155 B32934A3824 B32934A3335 B32934A3474 B32934A3684 B32934A3105M B32934A3475M B32934A3564
OCR Text ...ture Top,max (Top = Tamb + self-heating) Dissipation factor tan (in 10-3) at 20 C (upper limit values) Insulation resistance Rins or time c...cooling immediately after soldering Terminal characteristics: diameter, length, thermal resistance, ...
Description Metallized Polyester Film Capacitors (MKT)

File Size 291.01K  /  18 Page

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    BAS16TT1

ONSEMI[ON Semiconductor]
Part No. BAS16TT1
OCR Text ...data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C. * The soldering tempera...cooling should be used as the use of forced cooling will increase the temperature gradient and resul...
Description Silicon Switching Diode

File Size 123.64K  /  8 Page

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    BAS16WT1 ON0115

Motorola, Inc.
MOTOROLA[Motorola, Inc]
Part No. BAS16WT1 ON0115
OCR Text ...data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C. * The soldering temp...cooling should be used as the use of forced cooling will increase the temperature gradient and resul...
Description CASE 419-02, STYLE 2 SC-70/SOT-323
From old datasheet system

File Size 96.40K  /  6 Page

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    MAX852008 MAX8521EWX

Maxim Integrated Products
Part No. MAX852008 MAX8521EWX
OCR Text ...nt, requiring a small amount of heating or cooling. An analog control signal precisely sets the TEC current. Both devices feature accurate, individually-adjustable heating current limit and cooling current limit along with maximum TEC volta...
Description Smallest TEC Power Drivers for Optical Modules

File Size 333.80K  /  18 Page

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    BAV70WT1 ON0133

MOTOROLA[Motorola, Inc]
Part No. BAV70WT1 ON0133
OCR Text ...data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C. * The soldering temp...cooling should be used as the use of forced cooling will increase the temperature gradient and resul...
Description From old datasheet system
CASE 419-02, STYLE 5 SC-70/SOT-323

File Size 97.76K  /  6 Page

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    C2-6N8J-10 C2-R15J-10 C2-R10J-10 C2-8N2J-10 C2-R12J-10 C2-1N8S-10 C2-12NJ-10 C2-18NJ-10 C2-27NJ-10 C2-33NJ-10 C2-39NJ-10

Superworld Electronics
http://
Part No. C2-6N8J-10 C2-R15J-10 C2-R10J-10 C2-8N2J-10 C2-R12J-10 C2-1N8S-10 C2-12NJ-10 C2-18NJ-10 C2-27NJ-10 C2-33NJ-10 C2-39NJ-10 C2-56NJ-10 C2-82NJ-10 C2-10NJ-10 C2-15NJ-10 C2-22NJ-10 C2-47NJ-10 C2-68NJ-10 C2-2N7S-10 C2-4N7S-10 C2-3N3S-10 C2-3N9S-10 C2-5N6S-10
OCR Text ... conditions C2 SERIES Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150C max. Also cooling into the solvent after soldering should be in such a way that the temper...
Description CERAMIC CHIP INDUCTORS

File Size 374.34K  /  7 Page

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For heating cooling Found Datasheets File :: 3432    Search Time::1.703ms    
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