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Agilent (Hewlett-Packard)
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| Part No. |
HDSP-S80E HDSP-S80G HDSP-S85E HDSP-S85G
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| Description |
HDSP-S80E · 17.5 mm (0.69 inch) General Purpose 8x8 Dot Matrix Alphanumeric Displays
HDSP-S80G · 17.5 mm (0.69 inch) General Purpose 8x8 Dot Matrix Alphanumeric Displays
HDSP-S85E · 17.5 mm (0.69 inch) General Purpose 8x8 Dot Matrix Alphanumeric Displays
HDSP-S85G · 17.5 mm (0.69 inch) General Purpose 8x8 Dot Matrix Alphanumeric Displays
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| File Size |
91.05K /
8 Page |
 View
it Online |
Download Datasheet
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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
TLP3403SRHA
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| Description |
Photorelay (MOSFET output, 1-form-a), 20 V/1.5 A, 500 Vrms, S-VSON4T
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| Tech specs |
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Official Product Page
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HIROSE ELECTRIC Co., Ltd.
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| Part No. |
HDSP-703A HDSP-701G HDSP-701E HDSP-701A
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| Description |
Low-Cost Molded VRS Sensor, 6,2 mm [0.243 in] diameter, 10 Vp-p, -18 ºC to 60 ºC [0 ºF to 140 ºF], 32 DP (module 0.80) or coarser, 19 mm [0.75 in] approx. length
Low-Cost Molded VRS Sensor, 6,4 mm [0.250 in] diameter, 10 Vp-p, -40 ºC to 107 ºC [-40 ºF to 225 ºF], 32 DP (module 0.80) or coarser, 25 mm [1.00 in] approx. length
Low-Cost Molded VRS Sensor, 11,2 mm [0.438 in] diameter, 17.5 Vp-p, -18 ºC to 930 ºC [0 ºF to 200 ºF], 26 DP (module 0.98) or coarser, 32 mm [1.25 in] approx. length
High Resolution VRS Sensor, 9,5 mm [0.375 in] M12 diameter, 55 Vp-p, -40 ºC to 107 ºC [-40 ºF to 225 ºF], 36 DP (module 0.70) or coarser, 40 kHz, 32 mm [1.25 in] approx. length
High Resolution VRS Sensor, 9,5 mm [0.375 in] M12 diameter, 55 Vp-p, -40 ºC to 107 ºC [-40 ºF to 225 ºF], 36 DP (module 0.70) or coarser, 40 kHz, 32 mm [1.25 in] approx. length 17.3毫米.68英寸）通用5x7点阵的字母数字显示器
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| File Size |
212.19K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
59132-F34-03-075
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| Description |
Minitek® 2.00mm, Board to Board Connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 6 Positions, 2.00mm (0.079in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
59132-G34-03-050LF
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| Description |
Minitek® 2.00mm, Board to Board Connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 6 Positions, 2.00mm (0.079in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
RJE1R288223403
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| Description |
Modular Jacks, Input Output Connectors, 8P8C, Cat5e, Stacked, Shield, No LEDs
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77315-434-03LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 3 Positions 2.54mm (0.100in) Pitch, Right Angle
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68683-403LF
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| Description |
Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Top Entry, 6 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
89883-403LF
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| Description |
Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Right Angle, Through Hole, Top Entry, Double row , 6 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10119333-403A03LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Surface Mount, Single row , 3 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
RJE1R288233403
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| Description |
Modular Jacks, Input Output Connectors, 8P8C, Cat5e over Cat6, Stacked, Shield, No LEDs
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
69173-403HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 3 Positions, 2.54 mm Pitch, Vertical, 7.49 mm (0.295 in.) Mating, 3.42 mm (0.135 in.) Tail
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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