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  HDC6.0CA Datasheet PDF File

For HDC6.0CA Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    Mitsubishi Electric Corporation
Part No. RM50C1A-XXS RM50DA-C1A-XXS RM50DA/CA/C1A-XXS RM50CA-XXS RM50DA-XXS
Description FAST RECOVERY DIODE MODULES MEDIUM POWER, HIGH FREQUENCY USE INSULATED TYPE
Fast Recovery Diode Modules, F Series (for IGBT speed switching)
MEDIUM POWER/ HIGH FREQUENCY USE INSULATED TYPE
File Size 53.09K  /  3 Page

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Amphenol Communications Solutions
Part No. L717HDC62P
Description Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Pin, Flash Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    RM50DA-XXF RM50CA-XXF RM50C1A-XXF RM50

Mitsubishi Electric Sem...
Mitsubishi Electric Semiconductor
Part No. RM50DA-XXF RM50CA-XXF RM50C1A-XXF RM50
Description HIGH SPEED SWITCHING USE INSULATED TYPE
File Size 47.93K  /  3 Page

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Amphenol Communications Solutions
Part No. L777HDC62PVF
Description Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Pin, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock
Tech specs 　 　

Official Product Page

    Mitsubishi Electric Corporation
Part No. RM20C1A-XXS RM20DA/CA/C1A-XXS RM20CA-XXS RM20DA-XXS
Description FAST RECOVERY DIODE MODULES MEDIUM POWER, HIGH FREQUENCY USE INSULATED TYPE
Fast Recovery Diode Modules, F Series (for IGBT speed switching)
MEDIUM POWER/ HIGH FREQUENCY USE INSULATED TYPE
File Size 53.06K  /  3 Page

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Amphenol Communications Solutions
Part No. L777HDC62PD1CH4R
Description Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Pin, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock
Tech specs 　 　

Official Product Page

    EPSON TOYOCOM CORP
Part No. HG-2150CA60.0000M-SVC
Description CRYSTAL OSCILLATOR, CLOCK, 60 MHz, CMOS OUTPUT
File Size 206.49K  /  2 Page

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Amphenol Communications Solutions
Part No. L177HDC62SD1CH4R
Description Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock
Tech specs 　 　

Official Product Page

    RM20CA-XXS RM20C1A-XXS RM20DA-XXS

Mitsubishi Electric, Corp.
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RM20CA-XXS RM20C1A-XXS RM20DA-XXS
Description MEDIUM POWER/ HIGH FREQUENCY USE INSULATED TYPE
MEDIUM POWER, HIGH FREQUENCY USE INSULATED TYPE 中功率，高频率使用的绝缘
File Size 47.71K  /  3 Page

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Amphenol Communications Solutions
Part No. L717HDC62PC309
Description Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Pin, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
Tech specs 　 　

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    Atmel, Corp.
Part No. AT90CAN64
Description 8-bit Automotive AVR Microcontroller, 64KB ISP Flash, CAN Controller
File Size 363.49K  /  16 Page

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Amphenol Communications Solutions
Part No. L717HDC62POL2C309
Description Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 62 Pin, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
Tech specs 　 　

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Part No. 52581-130CAHLF
Description 68 CONTACT(S), MALE, RIGHT ANGLE PCMCIA CONNECTOR, SOLDER
File Size 171.10K  /  1 Page

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Amphenol Communications Solutions
Part No. L77HDC62SD1CH3RC309
Description Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Socket, 0.76m (30 in) Gold, M3 Rear Threaded Insert, Ground Tab, With Boardlock
Tech specs 　 　

Official Product Page

    PJ3800CS PJ3800 PJ3800CA

List of Unclassifed Manufacturers
ETC[ETC]
Part No. PJ3800CS PJ3800 PJ3800CA
Description Low Voltage Switching Regulator Controller
File Size 297.73K  /  7 Page

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Amphenol Communications Solutions
Part No. L777HDC62P
Description Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Pin, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
Tech specs 　 　

Official Product Page

    RM50DA-XXS RM50CA-XXS RM50C1A-XXS RM50

Mitsubishi Electric, Corp.
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RM50DA-XXS RM50CA-XXS RM50C1A-XXS RM50
Description MEDIUM POWER, HIGH FREQUENCY USE INSULATED TYPE 中功率，高频率使用的绝缘
File Size 47.75K  /  3 Page

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Amphenol Communications Solutions
Part No. L77HDC62SOL2
Description Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 62 Socket, Flash Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
Tech specs 　 　

Official Product Page

    Intel
Part No. KU80960CA-16 KU80960CA-25 KU80960CA-33
Description 32-bit high-performanc embedded processor 16MHz
32-bit high-performanc embedded processor 25MHz
32-bit high-performanc embedded processor 33MHz
File Size 947.74K  /  68 Page

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Amphenol Communications Solutions
Part No. L77HDC62SD1CH4R
Description Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Socket, Flash Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock
Tech specs 　 　

Official Product Page

For HDC6.0CA Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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