hardening pdf Datasheet P13 Full Text Search --- IC-ON-LINE


	Part Number	Hot Search : UPC4061C MC9S1 MC4460 BA5115 TDA5702 SEL1213C RC1602E DS1244Y
	Product Description
	Full Text Search

hardening Datasheet PDF File

For hardening Found Datasheets File :: 275 Search Time::1.281ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |

				Cypress Semiconductor
Part No.	CYRS1542AV18
OCR Text	... proprietary design and process hardening techniques. the qdr ii+ architecture has separate data inputs and data outputs to completely eliminate the need to turnaround the data bus that exists with common i/o devices. access to each port i...
Description	72-Mbit QDR? II SRAM Two-Word Burst
File Size	496.68K / 33 Page	View it Online	Download Datasheet

				Cypress Semiconductor
Part No.	CYRS1542AV18 CYRS1544AV18
OCR Text	... proprietary design and process hardening techniques. the qdr ii+ architecture has separate data inputs and data outputs to completely eliminate the need to turnaround the data bus that exists with common i/o devices. access to each port i...
Description	72-Mbit QDR II SRAM Two-Word Burst Architecture
File Size	422.24K / 33 Page	View it Online	Download Datasheet

				Aeroflex Circuit Technology
Part No.	5962F0151701QXA 5962F0151701QXC 5962F0151701QXX 5962F0151701QYA 5962F0151701QYC 5962F0151701QYX 5962F0151701VXA 5962F0151701VXC 5962F0151701VXX 5962F0151701VYA 5962F0151701VYC 5962F0151701VYX 5962G0151701QXA 5962G0151701QXX 5962G0151701QXC 5962G0151701QYA 5962G0151701QYC 5962G0151701QYX 5962G0151701VXA 5962G0151701VYA 5962G0151701VYC 5962G0151701VYX 5962H0151701QXA 5962H0151701QXC 5962H0151701QYA 5962H0151701QYC 5962H0151701QYX UT28F256LVC-65UPX UT28F256LVC-65PPX
OCR Text	...not available without radiation hardening. 4. lead finish: factory programming either solder or gold. field programming gold only. 10 ut28f256lv prom ut **** * ** - * * * * * * total dose: ( ) = none lead finish: (a) = solde...
Description	Radiation-hardenet 32K x 8 PROM: SMD. Class Q. 65ns acces time. Lead finish solder. Total dose 3E5 rads(Si). Radiation-hardenet 32K x 8 PROM: SMD. Class Q. 65ns acces time. Lead finish gold. Total dose 3E5 rads(Si). Radiation-hardenet 32K x 8 PROM: SMD. Class Q. 65ns acces time. Lead finish optional. Total dose 3E5 rads(Si). Radiation-hardenet 32K x 8 PROM: SMD. Class V. 65ns acces time. Lead finish solder. Total dose 3E5 rads(Si). Radiation-hardenet 32K x 8 PROM: SMD. Class V. 65ns acces time. Lead finish gold. Total dose 3E5 rads(Si). Radiation-hardenet 32K x 8 PROM: SMD. Class V. 65ns acces time. Lead finish optional. Total dose 3E5 rads(Si). Radiation-hardenet 32K x 8 PROM: SMD. Class Q. 65ns acces time. Lead finish solder. Total dose 5E5 rads(Si). Radiation-hardenet 32K x 8 PROM: SMD. Class Q. 65ns acces time. Lead finish optional. Total dose 5E5 rads(Si). Radiation-hardenet 32K x 8 PROM: SMD. Class Q. 65ns acces time. Lead finish gold. Total dose 5E5 rads(Si). Radiation-hardenet 32K x 8 PROM: SMD. Class V. 65ns acces time. Lead finish solder. Total dose 5E5 rads(Si). Radiation-hardenet 32K x 8 PROM: SMD. Class V. 65ns acces time. Lead finish gold. Total dose 5E5 rads(Si). Radiation-hardenet 32K x 8 PROM: SMD. Class V. 65ns acces time. Lead finish optional. Total dose 5E5 rads(Si). Radiation-hardenet 32K x 8 PROM: SMD. Class Q. 65ns acces time. Lead finish solder. Total dose 1E6 rads(Si). Radiation-hardenet 32K x 8 PROM: SMD. Class Q. 65ns acces time. Lead finish gold. Total dose 1E6 rads(Si). Radiation-hardenet 32K x 8 PROM: SMD. Class Q. 65ns acces time. Lead finish optional. Total dose 1E6 rads(Si). Radiation-hardenet 32K x 8 PROM. 65ns acces time. Lead finish optional.
File Size	67.34K / 11 Page	View it Online	Download Datasheet

				Rohm
Part No.	SML-H12Y8T
OCR Text	...nting 4-1. soldering ? no resin hardening agent such as filler is used in the sealing resin of the product. therefore, resin expansion and moisture absorption at humidity will cause heat stress during soldering process and finally has bad...
Description	Abundant color variations with diverse luminous intensity types.
File Size	1,108.69K / 8 Page	View it Online	Download Datasheet

				STMicroelectronics
Part No.	AN1709
OCR Text	...s therefore, must now apply emc hardening techniques in the design of firmware, pcb layout and at system level. this note aims to explain st microcon- troller emc features and compliance standards to help application designers reach the op-...
Description	EMC DESIGN GUIDE FOR ST MICROCONTROLLERS
File Size	571.29K / 38 Page	View it Online	Download Datasheet

				SGS Thomson Microelectronics ST Microelectronics STMICROELECTRONICS[STMicroelectronics] 意法半导
Part No.	ESDA6V1L ESDA5V3L ESDA14V2L ESDA25L 7058 ESDAXXL ESDA14V2 ESDAL
OCR Text	... the routing and contributes to hardening againt ESD. I/O I/O I/O I/O ESD sensitive device GND 2 * ESDAXXL 2. Circuit Board Layout Circuit board layout is a critical design step in the suppression of ESD induced transients. T...
Description	DUAL TRANSIL ARRAY FOR ESD PROTECTION From old datasheet system DUAL TRANSIL ARRAY FOR ESD PROTECTION 300 W, UNIDIRECTIONAL, 2 ELEMENT, SILICON, TVS DIODE
File Size	58.98K / 6 Page	View it Online	Download Datasheet

				Rohm
Part No.	CSL0406WBCW
OCR Text	... of the circuit board. no resin hardening agent such as filler is used in the sealing resin of the product. therefore, resin expansion and moisture absorption at humidity will cause heat stress during soldering process and finally has bad ...
Description	Side view white LEDs
File Size	838.96K / 8 Page	View it Online	Download Datasheet

				Rohm
Part No.	CSL07
OCR Text	...unting 4-1. soldering ?no resin hardening agent such as filler is used in the sealing resin of the product. therefore, resin expansion and moisture absorption at humidity will cause heat stress during soldering process and finally has bad ...
Description	Compact and lower height LEDs with lens
File Size	1,171.22K / 8 Page	View it Online	Download Datasheet

				Sanken Electric Co.,Ltd. SANKEN[Sanken electric] Sanken Electric Co., Ltd.
Part No.	SEC2764C SEC1603C SEC1201C SEC1203C SEC1801C SEC2462C SEC2422C SEC1001 SEC1101C SEC1901C SEC2464C SEC1703C SEC2424C SEC1601C SEC1403C SEC1501C
OCR Text	... temperature of components (C) hardening of adhesive 150max 120 sec. Room temperature Dip 260max Pre-heating 120max 30 sec. Time 5 sec. 3 Manual Soldering: Not more than 3 seconds at MAX 300C, under soldering iron. Time Reco...
Description	Chip LEDs SINGLE COLOR LED, GREEN, 1 mm Chip LEDs SINGLE COLOR LED, PURE GREEN, 2 mm
File Size	114.31K / 3 Page	View it Online	Download Datasheet

For hardening Found Datasheets File :: 275 Search Time::1.281ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |

▲Up To Search▲

Price and Availability