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  die-100 Datasheet PDF File

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    11-40-2011 T8303B 1140-2011 0011-40-2011 001140-2011

Molex Electronics Ltd.
Part No. 11-40-2011 T8303B 1140-2011 0011-40-2011 001140-2011
Description Terminator Die

File Size 19.42K  /  1 Page

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    Analog Devices, Inc.
Part No. OP-08G OP-08GR
Description OP-AMP, 300 uV OFFSET-MAX, 0.8 MHz BAND WIDTH, UUC7 DIE
OP-AMP, 1000 uV OFFSET-MAX, 0.8 MHz BAND WIDTH, UUC7 DIE

File Size 211.13K  /  7 Page

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    http://
IXYS[IXYS Corporation]
IXYS, Corp.
Part No. IXFN26N90 IXFN25N90 IXFN-26N90 IXFN-25N90
Description Discrete MOSFETs: HiPerFET Power MOSFETS
HiPerFETTM Power MOSFETs Single Die MOSFET
HiPerFET Power MOSFETs Single Die MOSFET 25 A, 900 V, 0.33 ohm, N-CHANNEL, Si, POWER, MOSFET

File Size 140.57K  /  4 Page

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    Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. MR18R326GAG0-CT9 MR18R326GAG0-CM8 MR18R326GAG0
Description (32Mx18) 16pcs RIMM Module based on 576Mb A-die, 32s banks,32K/32ms Ref, 2.5V 2Mx186个RIMM的模块基76Mb阿芯片,32秒银行,32K/32ms参考,.5V
(32Mx18) 16pcs RIMM Module based on 576Mb A-die 32s banks32K/32ms Ref 2.5V

File Size 256.70K  /  14 Page

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    Analog Devices, Inc.
Part No. OP-04N OP-14G OP-14N OP-14Z/883
Description DUAL OP-AMP, 750 uV OFFSET-MAX, 1.3 MHz BAND WIDTH, UUC14 DIE-14
DUAL OP-AMP, 2000 uV OFFSET-MAX, UUC14 DIE-14
DUAL OP-AMP, 3000 uV OFFSET-MAX, 1.3 MHz BAND WIDTH, CDIP8 HERMETIC SEALED, CERAMIC, DIP-8

File Size 814.27K  /  8 Page

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    PHA-1H-D PHA-1H-DF PHA-1H-DG PHA-1H-DP

Mini-Circuits
Part No. PHA-1H-D PHA-1H-DF PHA-1H-DG PHA-1H-DP
Description Monolithic Amplifier Die

File Size 245.10K  /  5 Page

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4R271669E
Description 128Mbit RDRAM(E-die)

File Size 292.00K  /  20 Page

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    PMA2-153LN-D PMA2-153LN-DF PMA2-153LN-DG PMA2-153LN-DP

Mini-Circuits
Part No. PMA2-153LN-D PMA2-153LN-DF PMA2-153LN-DG PMA2-153LN-DP
Description Monolithic Amplifier Die

File Size 237.57K  /  6 Page

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    SHENZHEN YONGERJIA INDU...
Part No. BZT52C5V1 BZT52C43
Description Planar Die Construction

File Size 256.08K  /  3 Page

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4R271669F
Description 128Mbit RDRAM(F-die)

File Size 293.32K  /  20 Page

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