crack pdf Datasheet P13 Full Text Search --- IC-ON-LINE


	Part Number	Hot Search : C1410 AV454 24LC32 L1043GD 87C552 EDR2D1 HL1566AF SUF30G
	Product Description
	Full Text Search

crack Datasheet PDF File

For crack Found Datasheets File :: 595 Search Time::0.969ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |

				HAMAMATSU[Hamamatsu Corporation]
Part No.	L7055-04
OCR Text	...cause the roots of the leads to crack, resulting in performance deterioration. This sometimes leads to wiring breakage. If the leads are soldered while external force is applied to the device, the residual force tends to degrade device perf...
Description	HIGH-POWER INFRARED PULSED LASER DIODE
File Size	89.45K / 2 Page	View it Online	Download Datasheet

				MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No.	RA07M2127M06 RA07M2127M-101 RA07M2127M
OCR Text	...amic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A thermal compound between module and heat sink is recommended for low thermal contact resist...
Description	RoHS Compliance ,215-270MHz 7W 7.2V, 2Stage Amp. For PORTABLE RADIO
File Size	90.50K / 8 Page	View it Online	Download Datasheet

				Sony Corporation
Part No.	ILX553A
OCR Text	...lowing can cause the package to crack or dust to be generated. (1) Applying repetitive bending stress to the external leads. (2) Applying heat to the external leads for an extended period of time with soldering iron. (3) Rapid cooling or he...
Description	5150-pixel CCD Linear Sensor (B/W)
File Size	107.96K / 12 Page	View it Online	Download Datasheet

				Sony Corporation
Part No.	ILX553B
OCR Text	...lowing can cause the package to crack or dust to be generated. (1) Applying repetitive bending stress to the external leads. (2) Applying heat to the external leads for an extended period of time with soldering iron. (3) Rapid cooling or he...
Description	From old datasheet system 5150-pixel CCD Linear Sensor B W
File Size	105.78K / 12 Page	View it Online	Download Datasheet

				SONY[Sony Corporation]
Part No.	ILX554A ILX554
OCR Text	...ollowing can cause the glass to crack because the upper and lower ceramic layers are shielded by low-melting glass. (1) Applying repetitive bending stress to the external leads. (2) Applying heat to the external leads for an extended period...
Description	2048-pixel CCD Linear Sensor(B/W) for 2048-pixel CCD Linear Sensor (B/W) for Single 5V Power Supply Bar-code Reader
File Size	106.68K / 13 Page	View it Online	Download Datasheet

				Sony Corporation
Part No.	ILX555K
OCR Text	...lowing can cause the package to crack or dust to be generated. (1) Applying repetitive bending stress to the external leads. (2) Applying heat to the external leads for an extended period of time with soldering iron. (3) Rapid cooling or he...
Description	10680 pixel × 3 line CCD Linear Sensor (Color) 10680pixel x 3line CCD Linear Sensor(Color) 10680 pixel 】 3 line CCD Linear Sensor (Color) From old datasheet system 10680 pixel 3 line CCD Linear Sensor (Color)
File Size	102.50K / 11 Page	View it Online	Download Datasheet

				Keenwood
Part No.	KDC-2026 KDC-3026
OCR Text	...ng shock. The unit may break or crack because it contains glass parts. * Do not touch the liquid crystal fluid if the LCD is damaged or broken due to shock. The liquid crystal fluid may be dangerous to your health or even fatal. If the liqu...
Description	(KDC-xxx) CD Receiver
File Size	376.63K / 20 Page	View it Online	Download Datasheet

				IDtech
Part No.	ITXG77H
OCR Text	... made of glass, it may break or crack if dropped or bumped on hard surface. 6) Since CMOS LSI is used in this module, take care of static electricity and insure human earth when handling. 7) Do not open nor modify the Module Assembly. 8) Do...
Description	14.1 XGA Color TFT / LCD Module
File Size	255.01K / 24 Page	View it Online	Download Datasheet

				Sharp Electrionic Components
Part No.	LT1ED90A
OCR Text	...fied tolerance Resin ond plated crack :0.3mm or more 9 could solder 50% or greater and less than 90% out of judgement area * 1 Judgement area The plated area of the product bottom Solderbility 2 Minor defect 0.4% _. __ _ DG- 992004...
Description	DEVICE SPECIFICATION FOR Light Emitting Diode
File Size	720.49K / 15 Page	View it Online	Download Datasheet

				SHARP[Sharp Electrionic Components]
Part No.	LT1ZE40A
OCR Text	...Dust and flaw Resin flash Resin crack Solderbility Not conforming to the specification Effect to the specification Over the unspecified tolerance 0.3mm or greater Corn the product side face Minor defect 0.4% could solder 50% or greate...
Description	DEVICE SPECIFICATION FOR . Light Emitting Diode
File Size	728.64K / 15 Page	View it Online	Download Datasheet

For crack Found Datasheets File :: 595 Search Time::0.969ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |