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bondpad Datasheet PDF File

For bondpad Found Datasheets File :: 130 Search Time::1.594ms
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				Cree, Inc Marktech Corporate
Part No.	C450DA700-0207 C450DA700-0209 C450DA700-0214 C460DA700-0208 C460DA700-0207 C460DA700-0213 C450DA700-0217 C450DA700-0213 C450DA700-0216 C460DA700-0211 C460DA700-0210 C460DA700-0212 C450DA700-0215 C450DA700-0218 C450DA700-0211 C460DA700-0209 C460DA700-0218 C460DA700-0214 C460DA700-0215 C450DA700-0219 C460DA700-0216 C450DA700-0206 C450DA700-0212 C450DA700-0205 C460DA700-0217 C460DA700-0205 C450DA700-0208 C450DA700-0210 C460DA700-0206 C460DA700-S43000 C450DA700-S43000 DA700-15
OCR Text	... effcient solution. the bondpad-down design allows for eutectic die attach, eliminating the need for wire bonds, and enables superior performance from improved thermal management. c xxx da700-...
Description	Direct Attach LED Technology Rectangular LED RF Performance Direct Attach DA700 LEDs
File Size	233.24K / 5 Page	View it Online	Download Datasheet

				Cree, Inc Marktech Corporate
Part No.	C460DA1000-0327 C460DA1000-0325 C460DA1000-0311 C460DA1000-0313 C460DA1000-0314 C460DA1000-0317 C460DA1000-0318 C460DA1000-0319 C460DA1000-0321 C460DA1000-0326 C460DA1000-S48500 C460DA1000-0309 C460DA1000-0310 C460DA1000-0312 C460DA1000-0315 C460DA1000-0316 C460DA1000-0320 C460DA1000-0322 C460DA1000-0323 C460DA1000-0324 C460DA1000-SXX000 C450DA1000-S48500 DA1000-15 C450DA1000-0309 C450DA1000-0310 C450DA1000-0311 C450DA1000-0312
OCR Text	...hly effcient solution. the bondpad-down design allows for a eutectic direct die-attach process, eliminating the need for wire bonds, and enables superior performance from improved thermal management. c xxx da...
Description	Direct Attach LED Technology Rectangular LED RF Performance LEDs Direct Attach DA1000 LEDs
File Size	250.21K / 5 Page	View it Online	Download Datasheet

				Cree, Inc Marktech Corporate
Part No.	C460DA3547-0306 C460DA3547-0307 C460DA3547-0308 C460DA3547-0309 C460DA3547-0305 CXXXDA3547-SXXX00 C450DA3547-SXXX00 C460DA3547-SXXX00 DA3547-15 C450DA3547-S07600 C460DA3547-S07600
OCR Text	... effcient solution. the bondpad- down design allows for eutectic die attach, eliminating the need for wire bonds, and enables superior performance from improved thermal management. the de...
Description	Rectangular LED RF Performance High Reliability - Eutectic Attach LEDs Direct Attach DA3547 LEDs
File Size	239.84K / 5 Page	View it Online	Download Datasheet

				Maxim Integrated Products
Part No.	MAX17108ETI
OCR Text	...3 = 0.6 microns (as drawn) g. bondpad dimensions: 5 mil. sq. h. isolation dielectric: sio 2 i. die separation method: wafer saw maxim integrated products. all rights reserve...
Description	MAXIM INTEGRATED PRODUCTS
File Size	29.55K / 5 Page	View it Online	Download Datasheet

				Riedon Powertron
Part No.	CBR0805 CBR0402 CBR0603 CBR06031OHM
OCR Text	...equest) dimensions l b d minmum bondpad size cbr 0402 0.041 +0.002 [ 1.04 +0.05 ] 0.020 +0.002 [ 0.50 +0.05 ] 0.012 +0.006 / -0.002 [ 0.3 +0.15 / -0.05 ] 0.006 x 0.006 [ 0.15 x 0.15 ] cbr 0603 0.060 +0.006 / -0.002 [ 1.5 +0.15 /...
Description	High Temperature Bondable Thick Film Chip Resistors
File Size	178.75K / 2 Page	View it Online	Download Datasheet

				List of Unclassifed Manufacturers
Part No.	LHA01APTAI001
OCR Text	...r / photoresist gap edge of bondpad area no metal / photoresist in indicated area. 4 over plating / partial plating panel filling holes ratio > 99% 5 over plating tooling hole no metal inside of ...
Description	LED Heat Dissipation Substrate
File Size	196.60K / 6 Page	View it Online	Download Datasheet

				List of Unclassifed Manufacturers
Part No.	LHA01APTAI004G
OCR Text	...r / photoresist gap edge of bondpad area no metal / photoresist in indicated area. 4 over plating / partial plating panel filling holes ratio > 99% 5 over plating tooling hole no metal inside of th e tool...
Description	LED Heat Dissipation Substrate
File Size	240.44K / 6 Page	View it Online	Download Datasheet

				List of Unclassifed Manufacturers
Part No.	LHA01APTAI004
OCR Text	...r / photoresist gap edge of bondpad area no metal / photoresist in indicated area. 4 over plating / partial plating panel filling holes ratio > 99% 5 over plating tooling hole no metal inside...
Description	LED Heat Dissipation Substrate
File Size	261.09K / 6 Page	View it Online	Download Datasheet

For bondpad Found Datasheets File :: 130 Search Time::1.594ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 |