| |
|
 |
Toshiba Electronic Devices & Storage Corporation |
| Part No. |
TPD2017FN
|
| Description |
Intelligent power device (Low side switch) / VDD=6 V / 8ch / SSOP30
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
54242-108201750LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
0877581216 87758-1216
|
| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
| File Size |
170.71K /
4 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
75844-201-72LF
|
| Description |
BERGSTIK
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
0877581050 87758-1050
|
| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
|
| File Size |
135.93K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
54122-110201700LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
59202-F40-20-174LF
|
| Description |
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 40 Positions.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
87758-3817 0877583817
|
| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 38 Circuits, 0.76μm(30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 38 Circuits, 0.76μm(30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
| File Size |
170.41K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
59202-G40-20-174LF
|
| Description |
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 40 Positions.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
54112-109201700LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
67292-017
|
| Description |
BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 34 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
72017-212LF
|
| Description |
5 Row Signal Receptacle, 150 Position, Straight, Solder to Board
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
90312-017LF
|
| Description |
Crimp-to-Wire Housing, Single Row, Pol. w/Latch, 17 Position
|
| Tech specs |
|
|
|
Official Product Page
|
|
Bom2Buy.com
Price and Availability
|
