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  76136-8501 Datasheet PDF File

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    85013-9023 0850139023

Molex Electronics Ltd.
Part No. 85013-9023 0850139023
Description 2.54mm (.100) Pitch DIN 41612 Header, Style R/2, Press-fit, Vertical, 48 Circuits

File Size 70.81K  /  3 Page

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Amphenol Communications Solutions

Part No. 91276-136HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    85015-9006 0850159006

Molex Electronics Ltd.
Part No. 85015-9006 0850159006
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Press-fit Style R , 0.6渭m (24渭) Selective Gold (Au), 128 Circuits, Lead Free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Press-fit Style R , 0.6μm (24μ) Selective Gold (Au), 128 Circuits, Lead Free

File Size 75.18K  /  3 Page

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Amphenol Communications Solutions

Part No. 95278-501-42LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 42 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    85013-3299 0850133299

Molex Electronics Ltd.
http://
Part No. 85013-3299 0850133299
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1μm (40μ) Selective Gold (Au), 96 Circuits, Lead free

File Size 67.57K  /  3 Page

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Amphenol Communications Solutions

Part No. 95278-501-46LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 46 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    87758-5017 0877585017

Molex Electronics Ltd.
Part No. 87758-5017 0877585017
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
   2.00mm (.079) Pitch Milli-Grid?Header, Through Hole, Vertical, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.76K  /  4 Page

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Amphenol Communications Solutions

Part No. 95278-501A16LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 16 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    87758-5016 0877585016

Molex Electronics Ltd.
Part No. 87758-5016 0877585016
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
   2.00mm (.079) Pitch Milli-Grid?Header, Through Hole, Vertical, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 95278-501A40LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 40 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    0767618501 76761-8501

Molex Electronics Ltd.
Part No. 0767618501 76761-8501
Description 2.00mm (.079) Pitch VHDM H Board-to-Board Backplane Header, Vertical, 6-Row, Guide Pin
2.00mm (.079") Pitch VHDM H Board-to-Board Backplane Header, Vertical, 6-Row, Guide Pin
MOLEX Connector

File Size 442.29K  /  4 Page

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Amphenol Communications Solutions

Part No. 95278-501B20LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 20 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    VAISH[Vaishali Semiconductor]
Part No. VT98501S1X VT98501 VT98501_D VT98501S1 VT98501/D
Description 3.3V Low Phase Noise Clock Multiplier

File Size 76.64K  /  4 Page

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Amphenol Communications Solutions

Part No. 95278-501B40LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 40 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    MOLEX INC
Part No. 0454850177
Description 58 CONTACT(S), POWER CONNECTOR, SOLDER

File Size 97.91K  /  1 Page

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Amphenol Communications Solutions

Part No. RJCSE508501
Description Modular Jack - Right Angle, Input Output Connectors 8P8C, Without Shield, With LEDs.
Tech specs    

Official Product Page

    ICST[Integrated Circuit Systems]
Part No. ICS8501BYT ICS8501 ICS8501BY
Description Low Skew 1-to-16 Differential Current Mode Fanout Buffer

File Size 159.69K  /  8 Page

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Amphenol Communications Solutions

Part No. 468-5010-061
Description VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 6 Row HSD, 10 positions, open, 4.75mm (0.187in), Header.
Tech specs    

Official Product Page

    85013-1029 0850131029

Molex Electronics Ltd.
Part No. 85013-1029 0850131029
Description 2.54mm (.100) Pitch DIN 41612 Header, Style R/2 Reverse, 0.6μm (24μ) Selective Gold (Au), 48 Circuits, with Beveled Metal Pins, Lead free

File Size 394.47K  /  9 Page

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Amphenol Communications Solutions

Part No. 498-5010-A62
Description VHDM®, Backplane connectors, Vertical Orientation, Press Fit Termination, 6 Row VHDM, 10 positions, right, A-Key, 6.25mm (0.246in), Header.
Tech specs    

Official Product Page

For 76136-8501 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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