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Amphenol Communications Solutions |
| Part No. |
10137926-2011LF
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| Description |
Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and Hold Down Header, Tin plating, Black Color, 20 Positions, GW Compatible LCP, Tape and Reel with cap.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-0322 0757570322
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 2 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 2 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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| File Size |
98.95K /
3 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
85966-201LF
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| Description |
Metral® Board Connectors, Backplane Connectors, 4 Row Signal Receptacle, Straight, Solder-to-Board, LF.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10120706-2010LF
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| Description |
CXP Passive Copper Cable Assemblies, Passive, 14Gb/s, 30 AWG, 1.0m, non-halogen free
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10120706-2010HLF
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| Description |
CXP Passive Copper Cable Assemblies, Passive, 14Gb/s, 30 AWG, 1.0m, Halogen free
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-6261 0757576261
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| Description |
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 12 Circuits, 1.25μm(50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 12 Circuits, 1.25μm(50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on
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| File Size |
166.28K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
95620-120CALF
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| Description |
Assembly, Top Mount, S/D(68Pins), R/A, Type 123, 5V, 2.2mm s/o, Left Push Rod Eject, 8mm Card Travel
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-0252 0757570252
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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| File Size |
99.21K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
RJE01J6201
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| Description |
Modular Jack - Right Angle, Input Output Connectors 6P6C, Shield.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
http://
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| Part No. |
0757576441 75757-6441
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| Description |
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 8 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 27.77mm (1.093) Mating Pin Length, 3.05mm (.120) PC Tail Length
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 8 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 27.77mm (1.093) Mating Pin Length, 3.05mm (.120) PC Tail Length
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| File Size |
166.19K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
RJE721886201
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| Description |
Modular Jack, 8P8C, CAT5e, Shield, Recessed Profile, With LEDs
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-0352 0757570352
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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| File Size |
99.22K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10112620-106LF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Stacking Vertical Header, Press Fit, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0757576431 75757-6431
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| Description |
3.50mm (.138") Pitch, MX150 Header, Breakaway, Vertical, 6 Circuits, 1.5um (60u") Tin (Sn) Plating
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 6 Circuits, 1.5um (60u) Tin (Sn) Plating
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| File Size |
166.21K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
UE863G262010361
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| Description |
2X2SFP ULTRAPORT W/H LP
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-0331 0757570331
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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| File Size |
99.21K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10129206-2011101LF
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| Description |
DDR4 DIMM, Ultra Low Profile, Storage and Server Connector, Vertical , Through Hole, 288 Position , 0.85mm (0.033in) Pitch
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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