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  74300-1153 Datasheet PDF File

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    LPM-1153BMU813

Rohm
Part No. LPM-1153BMU813
Description Full color dot matrix unit
File Size 123.43K  /  2 Page

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Amphenol Communications Solutions
Part No. 10111743-009LF
Description HPCE R/A REC 52P22S
Tech specs 　 　

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HUA FENG CIRCUIT





    LPM-1153BMU602

ROHM
Part No. LPM-1153BMU602
Description LED Displays > LED Dot Matrix Units > 24x48 Dots Matrix Units
File Size 73.09K  /  1 Page

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Amphenol Communications Solutions
Part No. 10111743-008LF
Description HPCE R/A REC 52P22S
Tech specs 　 　

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    LPM-1153BMU801

Rohm
Part No. LPM-1153BMU801
Description Full color dot matrix unit
File Size 103.69K  /  2 Page

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Amphenol Communications Solutions
Part No. 47743-002LF
Description PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
Tech specs 　 　

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    TE Connectivity Ltd
Part No. 0-1721956-6 0-1721150-5 0-1721150-2 0-1721150-8 0-1721153-8 0-1721958-5
Description    Compact relay with 1 Form A and 1 Form C contact arrangement
File Size 353.20K  /  3 Page

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Amphenol Communications Solutions
Part No. U10A474300T
Description SlimSAS Right angle X8 15u\\ Gold plating, Latch pin length=1.5mm, 24G, T&R packing
Tech specs 　 　

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    Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S511533F K4S511533F-YC K4S511533F-F1H K4S511533F-F1L K4S511533F-F75 K4S511533F-L
Description 8M x 16Bit x 4 Banks Mobile SDRAM in 54FBGA 8米16 × 4银行4FBGA移动SDRAM
File Size 105.17K  /  12 Page

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Amphenol Communications Solutions
Part No. U10BH7430001T
Description SlimSAS Vertical X8 15u\\ Gold plating, Latch pin inside, Latch pin length=1.5mm, 24G, T&R packing
Tech specs 　 　

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Part No. K4S511533C-YL1H
Description 32M X 16 SYNCHRONOUS DRAM, 7 ns, PBGA54
File Size 115.25K  /  8 Page

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Amphenol Communications Solutions
Part No. 77430-001LF
Description Din Accessory Shroud Stand off
Tech specs 　 　

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Part No. HA11532MP HA11532NT
Description TISP Thyristor Overvoltage Protectors
TV/Video Signal Processor
File Size 88.00K  /  4 Page

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Amphenol Communications Solutions
Part No. 47743-000LF
Description PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
Tech specs 　 　

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    4510002 15517 731153 U1732C

List of Unclassifed Manufacturers
List of Unclassifed Man...
Omron Electronics LLC
Part No. 4510002 15517 731153 U1732C
Description Di (2┸ethylhexyl) phthalate (DEHP) Also known as Di┸octyl phthalate (DOP)
DEHP is a substance that is used as a plasticiser to make PVC plastic soft and flexible. It is a colourless and odourless organic chemical.
   Di (2┸ethylhexyl) phthalate (DEHP)
File Size 52.75K  /  1 Page

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Amphenol Communications Solutions
Part No. 65781-153
Description Dubox® 2.54mm, Board to Board Connector, Vertical card connector, Double Row, 2.54mm (0.100in) pitch ,26 Positions
Tech specs 　 　

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    0002091153 0002-09-1153 02-09-1154 02-09-1155 02-09-1156 000209-1153

Molex Electronics Ltd.
Part No. 0002091153 0002-09-1153 02-09-1154 02-09-1155 02-09-1156 000209-1153
Description CRIMP TERM FEMALE 093/(2.36)DIA/ FOR 14 THRU 18 AWG WIRE
File Size 73.31K  /  1 Page

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Amphenol Communications Solutions
Part No. GSB3115371F1HR
Description USB 3.2, Type A, Receptacle, Right Angle Stacked Sink, 9.91mm Height, 18 Pins, Shell Without Flange(T/B), Shell with Nickel Plating, Shell Dip Pitch 15.6mm, 30u\\ Gold, Dip 2.4mm, Blue High Temperature Housing, Tray Packaging
Tech specs 　 　

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    MAXIM INTEGRATED PRODUCTS INC
Part No. MAX1153BEUE-T
Description DIGITAL TEMP SENSOR-SERIAL, 10BIT(s), 0.75Cel, RECTANGULAR, SURFACE MOUNT
File Size 482.71K  /  29 Page

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Amphenol Communications Solutions
Part No. GSB311537FRHR
Description USB 3.2, Type A, Receptacle, Right Angle Stacked Sink, 9.91mm Height, 18 Pins, Shell with Nickel Plating, 30u\\ Gold, Dip 2.4mm, Blue High Temperature Housing, Tape and Reel Packaging
Tech specs 　 　

Official Product Page

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