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27T224C 1200AP CE66P2 2SC4644 SG7905L 00051 RSA0K11 F2812
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  73644-2009 Datasheet PDF File

For 73644-2009 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    0736440012

Molex Electronics Ltd.
Part No. 0736440012
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position G, 72 Circuits

File Size 166.78K  /  4 Page

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Amphenol Communications Solutions

Part No. 67292-009
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 18 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0736440006

Molex Electronics Ltd.
Part No. 0736440006
Description 2.00mm (.079") Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location

File Size 166.79K  /  4 Page

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Amphenol Communications Solutions

Part No. 10121002-009LF
Description HPCE R/A Receptacle 16P12S
Tech specs    

Official Product Page

    0736440004 73644-0004

Molex Electronics Ltd.
Part No. 0736440004 73644-0004
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position C, 72 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position C, 72 Circuits

File Size 166.78K  /  4 Page

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Amphenol Communications Solutions

Part No. 61082-142009LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 140 Positions.
Tech specs    

Official Product Page

    0736440002 73644-0002

Molex Electronics Ltd.
Part No. 0736440002 73644-0002
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position B, 72 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position B, 72 Circuits

File Size 166.79K  /  4 Page

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Amphenol Communications Solutions

Part No. 59112-T40-20-090LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 40 Positions.
Tech specs    

Official Product Page

    0736440117 73644-0117

Molex Electronics Ltd.
Part No. 0736440117 73644-0117
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position N/A, 72 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position N/A, 72 Circuits

File Size 159.09K  /  4 Page

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Amphenol Communications Solutions

Part No. 54242-103200950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    73644-1001 0736441001

Molex Electronics Ltd.
Part No. 73644-1001 0736441001
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position A, 144 Circuits

File Size 167.84K  /  4 Page

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Amphenol Communications Solutions

Part No. 54242-807200950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    73644-1000 0736441000

Molex Electronics Ltd.
Part No. 73644-1000 0736441000
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position A, 144 Circuits

File Size 167.84K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-106200950LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0736443105 73644-3105

Molex Electronics Ltd.
Part No. 0736443105 73644-3105
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position C, 144 Circuits

File Size 164.13K  /  4 Page

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Amphenol Communications Solutions

Part No. 10142632-009LF
Description Minitek MicroSpace™ 1.80mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Receptacle, 9 Position<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
Tech specs    

Official Product Page

    73644-2207 0736442207

Molex Electronics Ltd.
Part No. 73644-2207 0736442207
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location D, Polarizing Key Position A, 72 Circuits

File Size 174.00K  /  4 Page

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Amphenol Communications Solutions

Part No. 10119109-372009LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 72 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    73644-2200 0736442200

Molex Electronics Ltd.
Part No. 73644-2200 0736442200
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position A, 72 Circuits

File Size 164.18K  /  4 Page

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Amphenol Communications Solutions

Part No. 73932-2009LF
Description 5 Row Signal Header, Straight, Press-Fit, Wide body, 3 Mod
Tech specs    

Official Product Page

For 73644-2009 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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