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  68145-2811 Datasheet PDF File

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Part No. SLP-28112710100
Description 127 um, MULTI MODE, SIMPLEX ST CONNECTOR, PLUG

File Size 114.84K  /  12 Page

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Amphenol Communications Solutions

Part No. 10114828-11206LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 6 Positions
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    SD-44828-001 448281162 UCP2008-0962

Molex Electronics Ltd.
Part No. SD-44828-001 448281162 UCP2008-0962
Description 0.8MM HANDYLINK SMT RECEPTACLE 16 CIRCUIT

File Size 1,220.55K  /  27 Page

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Amphenol Communications Solutions

Part No. 54112-811121900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    ZC2811ETA ZC5800E ZC2800E

Diodes Incorporated
Part No. ZC2811ETA ZC5800E ZC2800E
Description SOT23 SCHOTTKY BARRIER DIODES

File Size 101.99K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114828-11115LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 15 Positions
Tech specs    

Official Product Page

    MIC2811-4GMSYML MIC2821-4GMSYML MIC2821-4GJLYML MIC2811-4GJLYML

Micrel Semiconductor
Part No. MIC2811-4GMSYML MIC2821-4GMSYML MIC2821-4GJLYML MIC2811-4GJLYML
Description Digital Power Management IC 2MHz, 600mA DC/DC with Triple 300mA LDOs

File Size 460.63K  /  17 Page

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Amphenol Communications Solutions

Part No. 10114828-11110LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 10 Positions
Tech specs    

Official Product Page

    MX23L12811 MX23L12811MC-10 MX23L12811MC-12 MX23L12811MC-90

Macronix International Co., Ltd.
Part No. MX23L12811 MX23L12811MC-10 MX23L12811MC-12 MX23L12811MC-90
Description 128M-BIT (8M x 16) MASK ROM WITH PAGE MODE(SOP ONLY)

File Size 228.76K  /  6 Page

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Amphenol Communications Solutions

Part No. 54112-811042400LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

   
Part No. GMM7328110BS-8 GMM7328110BS-7
Description x32 EDO Page Mode DRAM Module

File Size 898.78K  /  16 Page

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Amphenol Communications Solutions

Part No. 54122-811161900LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    Electronic Theatre Controls, Inc.
Part No. MX26L12811MC-12
Description 128M [x8/x16] SINGLE 3V PAGE MODE MTP MEMORY

File Size 259.64K  /  32 Page

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Amphenol Communications Solutions

Part No. 54122-811401800LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 40 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    MX26L12811MC MX26L12811MC-12

List of Unclassifed Manufacturers
Part No. MX26L12811MC MX26L12811MC-12
Description 128M [x8/x16] SINGLE 3V PAGE MODE MTP MEMORY

File Size 251.82K  /  32 Page

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Amphenol Communications Solutions

Part No. 10114828-11106LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 6 Positions
Tech specs    

Official Product Page

    MXIC
MCNIX[Macronix International]
Part No. MX23L12811 MX23L12811MC-12 23L12811-10 23L12811-12 MX23L12811MC-10
Description 128M-BIT (8M x 16) MASK ROM WITH PAGE MODE(SOP ONLY)

File Size 176.41K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114828-11108LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 8 Positions
Tech specs    

Official Product Page

    MXIC
ETC[ETC]
Part No. MX26L12811MC MX26L12811MC-12
Description 128M [x8/x16] SINGLE 3V PAGE MODE MTP MEMORY

File Size 245.48K  /  32 Page

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Amphenol Communications Solutions

Part No. 54242-811162350LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

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