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  1801 Datasheet PDF File

For 1801 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    Samsung Electronic
Part No. K7N801801M
Description 256Kx36 & 512Kx18 Pipelined NtRAMData Sheet

File Size 387.67K  /  17 Page

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Amphenol Communications Solutions

Part No. 98401-801-28LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 28 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    1801500001

Molex Electronics Ltd.
Part No. 1801500001
Description LED Array Holder for Bridgelux ES, with Lens Cover

File Size 42.21K  /  1 Page

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Amphenol Communications Solutions

Part No. 98401-801A34LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 34 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Samsung Electronic
Part No. K7N801801A
Description 512Kx18-Bit Pipelined NtRAMData Sheet

File Size 457.16K  /  20 Page

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Amphenol Communications Solutions

Part No. 98401-801-50LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    ALSC[Alliance Semiconductor Corporation]
Alliance Semiconductor, Corp.
Part No. AS80M1801 AS80M1800
Description 7 to 20 V, EMI reduction IC for switching power supply
From old datasheet system
EMI Reduction IC for Switching Power Supplies 电磁干扰降低集成电路开关电

File Size 26.06K  /  2 Page

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Amphenol Communications Solutions

Part No. 98401-801-20LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87911-8011 0879118011

Molex Electronics Ltd.
Part No. 87911-8011 0879118011
Description 2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 80 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 80 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free

File Size 360.70K  /  6 Page

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Amphenol Communications Solutions

Part No. 87180-184C
Description Modular Jack, CAT 3, Low Profile, 8P4C, Right Angle, Through Mount, Without Shield, Snap Peg, 1 Port
Tech specs    

Official Product Page

    0887418010

Molex Electronics Ltd.
Part No. 0887418010
Description MicroCross DVI Digital Visual Interface, Shielded I/O Cable Assembly: DVI-Digital-to-DVI-Digital, Single Link TMDS, Black, 3.0m (9.84) Length
MicroCross垄芒 DVI Digital Visual Interface, Shielded I/O Cable Assembly: DVI-Digital-to-DVI-Digital, Single Link TMDS, Black, 3.0m (9.84) Length

File Size 212.52K  /  3 Page

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Amphenol Communications Solutions

Part No. 77311-801-02LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 02 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    0923171801

Molex Electronics Ltd.
Part No. 0923171801
Description Picoflex PF-50 IDT-to-IDT Z-Style, 18 Circuits, 1.0m (3.28 ) Length

File Size 122.22K  /  2 Page

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Amphenol Communications Solutions

Part No. 77311-801-18LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    MGF1801BT1 MGF1801BT

Mitsubishi Electric Sem...
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. MGF1801BT1 MGF1801BT
Description TAPE CARRIER MICROWAVE POWER GaAs FET

File Size 329.77K  /  4 Page

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Amphenol Communications Solutions

Part No. 77311-801-35LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    2673021801

Fair-Rite Products Corp.
Part No. 2673021801
Description 73 SHIELD BEAD

File Size 523.10K  /  5 Page

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Amphenol Communications Solutions

Part No. 77311-801-06LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 06 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    0430201801 43020-1801

Molex Electronics Ltd.
Part No. 0430201801 43020-1801
Description 3.00mm (.118) Pitch Micro-Fit 3.0?/a> Plug Housing, Dual Row, without Panel Mount Ears, 18 Circuits
3.00mm (.118) Pitch Micro-Fit 3.0 Plug Housing, Dual Row, without Panel Mount Ears, 18 Circuits

File Size 208.00K  /  2 Page

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Amphenol Communications Solutions

Part No. 77311-801-30LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

For 1801 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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