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AMI[AMI SEMICONDUCTOR]
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Part No. |
X2P998 X2P1148 X2P1346 X2P376 X2P528 X2P680
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OCR Text |
...cing costs by allowing existing tooling to be utilized. At the same time, tooling and manufacturing costs are significantly lower for the metal finishing process than for traditional 0.15mm cell based processes. The result is that XPressArr... |
Description |
0.15mm Structured ASIC
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File Size |
930.24K /
14 Page |
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it Online |
Download Datasheet |
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KYOCERA
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Part No. |
TCG057QV1AAG00
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OCR Text |
...to immediately scrap or destroy tooling for Kyocera modules for which no Purchase Orders have been received from the Customer in a two-year period.
VDD 3.0V 3.0V
0.3V
data
t1
t2
t3
D1,DH1 D1,DH
D2,DH1 D2,DH2
D3,DH... |
Description |
LCD_Module
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File Size |
313.64K /
17 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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