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  SI-8022 Datasheet PDF File

For SI-8022 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

    LTM8022EVPBF LTM8022-15

Linear Technology
Part No. LTM8022EVPBF LTM8022-15
Description 1A, 36V DC/DC &#181;Module; Package: LGA; No of Pins: 50; Temperature Range: -40&deg;C to 125&deg;C SWITCHING REGULATOR, 2400 kHz SWITCHING FREQ-MAX, PBGA50
1A, 36V DC/DC Module

File Size 272.12K  /  20 Page

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Amphenol Communications Solutions

Part No. 10119109-508022LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 8 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    DPX162170DT-8022B1

TDK Electronics
Part No. DPX162170DT-8022B1
Description    Multilayer Diplexer

File Size 75.32K  /  7 Page

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Amphenol Communications Solutions

Part No. 68022-158HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 58 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    ITT, Corp.
Maxim Integrated Products, Inc.
Part No. 5962-88778022A 5962-88778012C 5962-88778012X
Description 12-Bit Digital-to-Analog Converter 12位数字到模拟转换
General-Purpose, Low-Voltage, Single/Dual/Quad, TinyPack&trade; Comparators 12位数字到模拟转换

File Size 330.88K  /  11 Page

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Amphenol Communications Solutions

Part No. 68022-140H
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 40 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    VSC8021FI VSC8021 VSC8021FC VSC8022 VSC8022FC VSC8022FI

Vitesse Semiconductor Corporation
Part No. VSC8021FI VSC8021 VSC8021FC VSC8022 VSC8022FC VSC8022FI
Description 2.5GB/S SONET-COMPATIBLE 8-BIT MUX/DEMUX CHIPSET

File Size 211.31K  /  17 Page

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Amphenol Communications Solutions

Part No. 68022-466HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 66 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    AD802205 AD8022AR-REEL AD8022AR-REEL7 AD8022ARZ-REEL AD8022ARMZ-REEL AD8022ARZ AD8022ARZ-REEL7

Analog Devices, Inc.
http://
Part No. AD802205 AD8022AR-REEL AD8022AR-REEL7 AD8022ARZ-REEL AD8022ARMZ-REEL AD8022ARZ AD8022ARZ-REEL7
Description Dual High Speed, Low Noise Op Amp; Package: SOIC; No of Pins: 8; Temperature Range: Industrial DUAL OP-AMP, 6250 uV OFFSET-MAX, 10 MHz BAND WIDTH, PDSO8
Dual High Speed, Low Noise Op Amp; Package: MSOP; No of Pins: 8; Temperature Range: Industrial DUAL OP-AMP, 6250 uV OFFSET-MAX, PDSO8
Dual High-Speed Low-Noise Op Amps DUAL OP-AMP, 6250 uV OFFSET-MAX, 10 MHz BAND WIDTH, PDSO8

File Size 273.35K  /  16 Page

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Amphenol Communications Solutions

Part No. 68022-272
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 72 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    Vitesse Semiconductor Corporation.
Vitesse Semiconductor, Corp.
Part No. VSC8021 VSC8021FC VSC8021FI VSC8022FC VSC8022FI
Description 2.5Gb/s SONET-Compatible 8-Bit MUX/DEMUX Chipset 容量高达2.5GB / sSONET的兼解复用器芯片

File Size 217.01K  /  17 Page

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Amphenol Communications Solutions

Part No. 68022-266HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 66 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

   
Part No. UPD8022C UPD8021C UPD87PG11E
Description Microcontroller

File Size 56.97K  /  1 Page

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Amphenol Communications Solutions

Part No. 68022-258HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 58 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    A-7720-B02HP909B 0022268022 22-26-8022

Molex Electronics Ltd.
Part No. A-7720-B02HP909B 0022268022 22-26-8022
Description 2.54mm (.100) KK? IDT Double Cantilever Contact, 2 Circuits, Tin (Sn), Feed-Through, 24 Stranded, Solid, Fused, Topcoat, and 26 Fused and Topcoat, Green ID Strip
2.54mm (.100) KK庐 IDT Double Cantilever Contact, 2 Circuits, Tin (Sn), Feed-Through, 24 Stranded, Solid, Fused, Topcoat, and 26 Fused and Topcoat, Green ID Stri
Molex Electronics Ltd.

File Size 484.92K  /  20 Page

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Amphenol Communications Solutions

Part No. 68022-464HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 64 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    SY88022ALMGTR

Micrel Semiconductor
Part No. SY88022ALMGTR
Description    11.3Gbps Laser Diode Driver

File Size 466.89K  /  12 Page

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Amphenol Communications Solutions

Part No. 68022-372HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 72 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    LTM8022IV-PBF LTM8022MPV LTM8022V LTM8022EV-PBF LTM8022MPV-PBF

Linear Technology
http://
Part No. LTM8022IV-PBF LTM8022MPV LTM8022V LTM8022EV-PBF LTM8022MPV-PBF
Description 1A, 36V DC/DC μModule

File Size 242.37K  /  20 Page

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Amphenol Communications Solutions

Part No. 68022-138HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 38 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

For SI-8022 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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