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  DTM1-0314 Datasheet PDF File

For DTM1-0314 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

    0743003144 74300-3144

Molex Electronics Ltd.
Part No. 0743003144 74300-3144
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, with Guide, 144 Circuits, Mounted Height 14.00mm (.551"), Press-Fit Pi
2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, with Guide, 144 Circuits, Mounted Height 14.00mm (.551), Press-Fit Pin

File Size 139.34K  /  3 Page

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Amphenol Communications Solutions

Part No. 68031-415HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 15 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0314026100 31402-6100

Molex Electronics Ltd.
Part No. 0314026100 31402-6100
Description 2.54mm (.100) MX64 Sealed Single Row Crimp Housing, GET Terminal, Black, 6Circuits, Mating Part: Keying A, Lock None

File Size 846.91K  /  7 Page

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Amphenol Communications Solutions

Part No. 68031-424HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 24 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail.
Tech specs    

Official Product Page

    26-60-3140 0026603140

Molex Electronics Ltd.
Part No. 26-60-3140 0026603140
Description 3.96mm (.156) Pitch KK Solid Header, Right Angle, without Peg, 14 Circuits, Tin (Sn) Plating

File Size 245.34K  /  10 Page

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Amphenol Communications Solutions

Part No. 68031-433HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail.
Tech specs    

Official Product Page

    0903270314 903270314

Molex Electronics Ltd.
Part No. 0903270314 903270314
Description 1.27mm (.050) Pitch Picoflex? PF-50, Low Profile, IDT Receptacle, 14 Circuits, Natural, Tin Plated
1.27mm (.050) Pitch Picoflex庐 PF-50, Low Profile, IDT Receptacle, 14 Circuits, Natural, Tin Plated

File Size 112.16K  /  3 Page

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Amphenol Communications Solutions

Part No. 68031-420HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 20 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail.
Tech specs    

Official Product Page

    0743003143 74300-3143

Molex Electronics Ltd.
Part No. 0743003143 74300-3143
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, with Guide, 144 Circuits, Mounted Height 13.00mm (.512"), Press-Fit P
2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, with Guide, 144 Circuits, Mounted Height 13.00mm (.512), Press-Fit Pin Length 3.00mm (.118)

File Size 201.57K  /  4 Page

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Amphenol Communications Solutions

Part No. 91900-31441LF
Description Conan® 1.00mm Pitch, Board To Board Connector, I - Industrial Series, Conan Vertical Header, Surface Mount, 41 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    31402-6110 0314026110

Molex Electronics Ltd.
Part No. 31402-6110 0314026110
Description 2.54mm (.100) MX64 Sealed Single Row Crimp Housing, GET Terminal, Black, 6Circuits, Mating Part: Keying A, Lock CPA

File Size 846.90K  /  7 Page

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Amphenol Communications Solutions

Part No. 86503-148HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 48 Positions, 2.54 mm Pitch, Vertical, 6.35 mm (0.25 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    31403-3100 0314033100

Molex Electronics Ltd.
Part No. 31403-3100 0314033100
Description 2.54mm (.100) MX64 Sealed Single Row Crimp Housing

File Size 709.77K  /  6 Page

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Amphenol Communications Solutions

Part No. 10127403-14H1400LF
Description PwrBlade® ULTRA Connector System, Power Connectors, Receptacle, 10HP+12S Vertical Through Hole
Tech specs    

Official Product Page

    Melexis Microelectronic
Part No. MLX90314AB
Description Programmable IR Sensor Interface

File Size 818.54K  /  28 Page

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Amphenol Communications Solutions

Part No. 130-3142-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Daughtercard Module, APP.
Tech specs    

Official Product Page

    0314036100 31403-6100

Molex Electronics Ltd.
Part No. 0314036100 31403-6100
Description 2.54mm (.100) MX64?/a> Sealed Single Row Crimp Housing, MX64?/a> Terminal, Black,6 Circuits, Mating Part: Keying A, Lock None
2.54mm (.100) MX64 Sealed Single Row Crimp Housing, MX64 Terminal, Black,6 Circuits, Mating Part: Keying A, Lock None

File Size 847.40K  /  7 Page

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Amphenol Communications Solutions

Part No. 68031-411HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail.
Tech specs    

Official Product Page

    0314081202

Molex Electronics Ltd.
Part No. 0314081202
Description USCAR 2.54mm

File Size 422.85K  /  4 Page

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Amphenol Communications Solutions

Part No. 10112690-F03-14ULF
Description Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Surface Mount - Double row - 28 Positions - 2mm (0.079inch) - Horizontal
Tech specs    

Official Product Page

For DTM1-0314 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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