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  DC22.2223.111 Datasheet PDF File

For DC22.2223.111 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

   
Part No. DM2233T-20 DM2223T-20
Description Enhanced DRAM (EDRAM)

File Size 1,076.02K  /  23 Page

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Amphenol Communications Solutions

Part No. 10122237-320012ALF
Description HPCE-STD STRADDLE MOUNT 32P12S
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    MCF52221 MCF52223

Freescale Semiconductor, Inc
Part No. MCF52221 MCF52223
Description
File Size 806.42K  /  56 Page

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Amphenol Communications Solutions

Part No. 10122238-160014ELF
Description HPCE STRADDLE MOUNT with Enhanced walls 16P14S
Tech specs    

Official Product Page

    L-com, Inc.
Part No. DM2223T-15 DM2233T-15 DM2233T-15I DM2223T-15I
Description Enhanced DRAM (EDRAM) 增强的DRAM(eDRAM内存

File Size 190.14K  /  30 Page

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Amphenol Communications Solutions

Part No. 10122238-320424ALF
Description HPCE STRADDLE MOUNT with Enhanced walls 36P24S
Tech specs    

Official Product Page

    MCF52223 MCF52221

Freescale Semiconductor, Inc
Part No. MCF52223 MCF52221
Description Microcontroller Data Sheet

File Size 817.42K  /  56 Page

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Amphenol Communications Solutions

Part No. 10122237-320424FLF
Description HPCE-STD STRADDLE MOUNT 36P24S
Tech specs    

Official Product Page

   
Part No. EL2223CN EL2223CM
Description 12-Bit, 3.3V, 130MSPS, CommLinkTM High Speed D/A Converter (TSSOP); Temperature Range: 0°C to 70°C; Package: 28-Eval Board
12-Bit, 3.3V, 130MSPS, CommLinkTM High Speed D/A Converter (TSSOP); Temperature Range: -40°C to 85°C; Package: 28-SOIC

File Size 932.63K  /  10 Page

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Amphenol Communications Solutions

Part No. 68022-238HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 38 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    FMC2223P1-02

Fujitsu Microelectronics
FUJITSU[Fujitsu Media Devices Limited]
Fujitsu Component Limited.
Part No. FMC2223P1-02
Description Ku K-Brand Power GaAs Modules

File Size 55.59K  /  2 Page

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Amphenol Communications Solutions

Part No. 10122238-001214ELF
Description HPCE STRADDLE MOUNT with Enhanced walls 12P14S
Tech specs    

Official Product Page

    FMC2223LN-03

Fujitsu Microelectronics
FUJITSU[Fujitsu Media Devices Limited]
Fujitsu Component Limited.
Part No. FMC2223LN-03
Description Ku K-Brand Power GaAs Modules

File Size 53.08K  /  2 Page

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Amphenol Communications Solutions

Part No. 10122238-320424ELF
Description HPCE STRADDLE MOUNT with Enhanced walls 36P24S
Tech specs    

Official Product Page

    FMC2223C6-03

Fujitsu Microelectronics
FUJITSU[Fujitsu Media Devices Limited]
Fujitsu Component Limited.
Part No. FMC2223C6-03
Description Ku K-Brand Power GaAs Modules

File Size 54.89K  /  2 Page

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Part No. 98426-G13-22-237LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 44 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    744822233

Wurth Elektronik GmbH & Co. KG, Germany.
Part No. 744822233
Description COMMON MODE CHOKE WE-CMB

File Size 124.21K  /  1 Page

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Amphenol Communications Solutions

Part No. 98426-S13-22-237LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 44 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    Fujitsu
Part No. FMC2223C6-03
Description K-Band Power GaAs Modules

File Size 123.01K  /  2 Page

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Amphenol Communications Solutions

Part No. 77311-822-23LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 23 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

For DC22.2223.111 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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