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SONY[Sony Corporation]
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| Part No. |
ILX550K
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| OCR Text |
...lowing can cause the package to crack or dust to be generated. (1) Applying repetitive bending stress to the external leads. (2) Applying heat to the external leads for an extended period of time with soldering iron. (3) Rapid cooling or he... |
| Description |
From old datasheet system
10680 pixel X 3 line CCD Linear Sensor (Color)
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| File Size |
148.42K /
11 Page |
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it Online |
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IRF
MITSUBISHI[Mitsubishi Electric Semiconductor]
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| Part No. |
RA03M8894M RA03M8894M-101 RDHA710SE10A2FK
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| OCR Text |
...amic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A thermal compound between module and heat sink is recommended for low thermal contact resist... |
| Description |
889-941MHz 3.6W 7.2V, 2 Stage Amp. For PORTABLE RADIO
Radiation Hardended, Solid-State Relay with Buffered Inputs
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| File Size |
90.50K /
8 Page |
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it Online |
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ONSEMI[ON Semiconductor]
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| Part No. |
MJF1503006 MJF15031G MJF15030 MJF15030G MJF15031
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| OCR Text |
.... lbs will cause the plastic to crack around the mounting hole, resulting in a loss of isolation capability. Additional tests on slotted 4-40 screws indicate that the screw slot fails between 15 to 20 in . lbs without adversely affecting th... |
| Description |
COMPLEMENTARY SILICON POWER TRANSISTORS 8 AMPERES 150 VOLTS, 36 WATTS
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| File Size |
139.91K /
6 Page |
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it Online |
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FAIRCHILD[Fairchild Semiconductor]
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| Part No. |
RMPA2266
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| OCR Text |
...iner grain structure and a more crack-resistant solder joint. The illustration below indicates the recommended soldering profile. Solder Joint Characteristics: Proper operation of this device depends on a reliable void-free attachment of th... |
| Description |
WCDMA Band I Power Amplifier Module
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| File Size |
189.22K /
7 Page |
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it Online |
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Mitsubishi Electric Corporation
MITSUBISHI[Mitsubishi Electric Semiconductor]
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| Part No. |
RA07M4047M RA07M4047M-E01 RA07M4047M-01
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| OCR Text |
...amic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A thermal compound between module and heat sink is recommended for low thermal contact resist... |
| Description |
400-470MHz 7W 7.2V PORTABLE RADIO
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| File Size |
59.04K /
9 Page |
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it Online |
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Matsushita Electric Works(Nais)
N.A.
NAIS[Nais(Matsushita Electric Works)]
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| Part No. |
EXB28V EXB2HV471JV EXB28V102JX
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| OCR Text |
... have chipping, flaw, flash and crack. Details of appearance criteria shall be as described in attached sheet
Appearance & Construction
MATSUSHITA ELECTRONIC COMPONENTS Co.,LTD.
Subject
Spec. No.
Chip Resistor Array PRODUCT S... |
| Description |
FEU CPL 0031.1801 0031.1811
Chip Resistor Array
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| File Size |
104.05K /
10 Page |
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it Online |
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Price and Availability
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